Single-Event Upset and Total Ionizing Dose Effects on DDR4 DRAM Due to Proton Irradiation Under Different Temperatures
- Authors
- Ryu, Minsang; Suh, Minki; Ha, Jonghyeon; Lee, Dabok; Lee, Hojoon; Sagong, Hyunchul; Kim, Jungsik
- Issue Date
- Sep-2025
- Publisher
- Institute of Electrical and Electronics Engineers
- Keywords
- Random access memory; Temperature measurement; Protons; Single event upsets; Measurement uncertainty; Density measurement; Temperature distribution; Particle beams; Space vehicles; Logic gates; Dynamic random access memory (DRAM); gate-induced drain leakage (GIDL); single-event upset (SEU); total ionizing dose (TID)
- Citation
- IEEE Transactions on Electron Devices, v.72, no.9, pp 5243 - 5246
- Pages
- 4
- Indexed
- SCIE
SCOPUS
- Journal Title
- IEEE Transactions on Electron Devices
- Volume
- 72
- Number
- 9
- Start Page
- 5243
- End Page
- 5246
- URI
- https://scholarworks.gnu.ac.kr/handle/sw.gnu/79958
- DOI
- 10.1109/TED.2025.3594607
- ISSN
- 0018-9383
1557-9646
- Abstract
- In this study, single-event upset (SEU) and total ionizing dose (TID) effects on DDR4 dynamic random access memory (DRAM) under 48-MeV proton radiation and various temperatures (153-373 K) were investigated. The SEU-induced error density reached a maximum of 5.59 x 10(-6) at 373 K and a minimum of 9.77 x 10(-10) at 153 K, which correlates with the increase in gate-induced drain leakage (GIDL) as temperature rises. After the device under test (DUT) was irradiated at 153, 300, and 373 K, the TID-induced error density was estimated. The generation of interface traps was higher at 373 K than at 153 K, leading to an increase in the TID-induced error density. However, the error density at 300 K was 1.1 times as high as that at 373 K. This occurs because the DUT irradiated at 373 K is more favorable for defect recovery via annealing than at 300 K.
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