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Single-Event Upset and Total Ionizing Dose Effects on DDR4 DRAM Due to Proton Irradiation Under Different Temperatures

Authors
Ryu, MinsangSuh, MinkiHa, JonghyeonLee, DabokLee, HojoonSagong, HyunchulKim, Jungsik
Issue Date
Sep-2025
Publisher
Institute of Electrical and Electronics Engineers
Keywords
Random access memory; Temperature measurement; Protons; Single event upsets; Measurement uncertainty; Density measurement; Temperature distribution; Particle beams; Space vehicles; Logic gates; Dynamic random access memory (DRAM); gate-induced drain leakage (GIDL); single-event upset (SEU); total ionizing dose (TID)
Citation
IEEE Transactions on Electron Devices, v.72, no.9, pp 5243 - 5246
Pages
4
Indexed
SCIE
SCOPUS
Journal Title
IEEE Transactions on Electron Devices
Volume
72
Number
9
Start Page
5243
End Page
5246
URI
https://scholarworks.gnu.ac.kr/handle/sw.gnu/79958
DOI
10.1109/TED.2025.3594607
ISSN
0018-9383
1557-9646
Abstract
In this study, single-event upset (SEU) and total ionizing dose (TID) effects on DDR4 dynamic random access memory (DRAM) under 48-MeV proton radiation and various temperatures (153-373 K) were investigated. The SEU-induced error density reached a maximum of 5.59 x 10(-6) at 373 K and a minimum of 9.77 x 10(-10) at 153 K, which correlates with the increase in gate-induced drain leakage (GIDL) as temperature rises. After the device under test (DUT) was irradiated at 153, 300, and 373 K, the TID-induced error density was estimated. The generation of interface traps was higher at 373 K than at 153 K, leading to an increase in the TID-induced error density. However, the error density at 300 K was 1.1 times as high as that at 373 K. This occurs because the DUT irradiated at 373 K is more favorable for defect recovery via annealing than at 300 K.
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IT공과대학 (전기공학과)
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