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Browsing by Han, S. Z.Author

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SCISCIESCOPUS
Crack growth rate of inclined and deflected surface-cracks in round-bar specimens of copper processed by equal channel angular pressing under cyclic loading

Goto, M.; Yamamoto, T.; Han, S. Z.; Kim, S.; Ahn, J-H.; Kitamura, J.; Iwarnura, T.; Lee, J.

ArticleIssue Date2017CitationENGINEERING FRACTURE MECHANICS, v.182, pp 100 - 113PublisherPERGAMON-ELSEVIER SCIENCE LTD
SCIESCOPUS
Crack initiation mechanism in ultrafine-grained copper fabricated by severe plastic deformation in the high-cycle fatigue regime

Goto, M.; Yamamoto, T.; Han, S. Z.; Lim, S. H.; Kim, S.; Ahn, J-H; Lee, S. J.; Yakushiji, T.; Lee, J.

ArticleIssue Date2020CitationMaterials Science and Engineering: A, v.788PublisherElsevier BV
SCISCIESCOPUSKCI
Effect of V addition on hardness and electrical conductivity in Cu-Ni-Si alloys

Han, S. Z.; Gu, J. H.; Lee, J. H.; Que, Z. P.; Shin, J. H.; Lim, S. H.; Kim, S. S.

ArticleIssue Date2013CitationMETALS AND MATERIALS INTERNATIONAL, v.19, no.4, pp 637 - 641PublisherKOREAN INST METALS MATERIALS
SCIESCOPUS
Effects of trace zirconium on the initiation and propagation behavior of fatigue cracks in Cu-6Ni-2Mn-2Sn-2Al alloy

Goto, M.; Han, S. Z.; Kim, C. J.; Kawagoishi, N.; Kim, S. S.

ArticleIssue Date2008CitationMATERIALS LETTERS, v.62, no.17-18, pp 2832 - 2835PublisherELSEVIER
SCISCIESCOPUS
Fatigue crack initiation and propagation behaviors of solution-treated and air-cooled Cu-6Ni-1.5Si alloy strengthened by precipitation hardening

Goto, M.; Iwamura, T.; Han, S. Z.; Kim, S.; Yamamoto, T.; Lim, S. H.; Ahn, J. -H.; Kitamura, J.; Lee, J.

ArticleIssue Date2019CitationInternational Journal of Fatigue, v.123, pp 135 - 143PublisherElsevier BV
SCIESCOPUS
Fatigue strength and formation behavior of surface damage in ultrafine grained copper with different non-equilibrium microstructures

Goto, M.; Han, S. Z.; Yakushiji, T.; Kim, S. S.; Lim, C. Y.

ArticleIssue Date2008CitationINTERNATIONAL JOURNAL OF FATIGUE, v.30, no.8, pp 1333 - 1344PublisherELSEVIER SCI LTD
SCISCIESCOPUS
Fatigue-induced grain coarsening and crack growth behavior in ultrafine-grained copper under different loading histories

Goto, M.; Kamil, K.; Han, S. Z.; Euh, K.; Kim, S. S.; Lee, J.

ArticleIssue Date2013CitationINTERNATIONAL JOURNAL OF FATIGUE, v.51, pp 57 - 67PublisherELSEVIER SCI LTD
SCISCIESCOPUS
Formation behavior of different topographies of crack growth path under high and low cyclic stresses in ultrafine-grained copper

Goto, M.; Kamil, K.; Han, S. Z.; Euh, K.; Yokoho, Y.; Kim, S. S.

ArticleIssue Date2012CitationSCRIPTA MATERIALIA, v.66, no.6, pp 355 - 358PublisherPERGAMON-ELSEVIER SCIENCE LTD
SCISCIESCOPUS
Formation mechanism of inclined fatigue-cracks in ultrafine-grained Cu processed by equal channel angular pressing

Goto, M.; Han, S. Z.; Yamamoto, T.; Kitamura, J.; Ahn, J. H.; Yakushiji, T.; Kim, S. S.; Lee, J.

ArticleIssue Date2016CitationINTERNATIONAL JOURNAL OF FATIGUE, v.92, pp 577 - 587PublisherELSEVIER SCI LTD
SCISCIESCOPUS
Formation of a high-cycle fatigue fracture surface and a crack growth mechanism of ultrafine-grained copper with different stages of microstructural evolution

Goto, M.; Han, S. Z.; Euh, K.; Kang, J-H; Kim, S. S.; Kawagoishi, N.

ArticleIssue Date2010CitationACTA MATERIALIA, v.58, no.19, pp 6294 - 6305PublisherPERGAMON-ELSEVIER SCIENCE LTD
SCIESCOPUS
Growth behavior of small surface cracks in coarse and ultrafine grained copperopen access

Goto, M.; Han, S. Z.; Ando, Y.; Kawagoishi, N.; Teshima, N.; Kim, S. S.

ArticleIssue Date2009CitationCOMPUTATIONAL METHODS AND EXPERIMENTAL MEASUREMENTS XIV, v.48, pp 497 - +PublisherWIT PRESS
SCIESCOPUS
Growth mechanism of a small surface crack of ultrafine-grained copper in a high-cycle fatigue regime

Goto, M.; Han, S. Z.; Kim, S. S.; Ando, Y.; Kawagoishi, N.

ArticleIssue Date2009CitationSCRIPTA MATERIALIA, v.60, no.8, pp 729 - 732PublisherPERGAMON-ELSEVIER SCIENCE LTD
SCISCIESCOPUS
High-cycle fatigue strength and small-crack growth behavior of ultrafine-grained copper with post-ECAP annealing

Goto, M.; Teshima, N.; Han, S. Z.; Euh, K.; Yakushiji, T.; Kim, S. S.; Lee, J.

ArticleIssue Date2013CitationENGINEERING FRACTURE MECHANICS, v.110, pp 218 - 232PublisherPERGAMON-ELSEVIER SCIENCE LTD
SCISCIESCOPUS
Microstructure-dependent fatigue behavior of aged Cu-6Ni-1.5Si alloy with discontinuous/cellular precipitates

Goto, M.; Yamamoto, T.; Han, S. Z.; Lim, S. H.; Kim, S.; Iwamura, T.; Kitamura, J.; Ahn, J. -H.; Yakushiji, T.; Lee, J.

ArticleIssue Date2019CitationMaterials Science and Engineering: A, v.747, pp 63 - 72PublisherElsevier BV
SCISCIESCOPUS
Role of microstructure on initiation and propagation of fatigue cracks in precipitate strengthened Cu-Ni-Si alloy

Goto, M.; Han, S. Z.; Lim, S. H.; Kitamura, J.; Fujimura, T.; Ahn, J. -H.; Yamamoto, T.; Kim, S.; Lee, J.

ArticleIssue Date2016CitationINTERNATIONAL JOURNAL OF FATIGUE, v.87, pp 15 - 21PublisherELSEVIER SCI LTD
SCISCIESCOPUS
S-N plots and related phenomena of ultrafine grained copper with different stages of microstructural evolution

Goto, M.; Han, S. Z.; Kitamura, J.; Yakushiji, T.; Ahn, J. H.; Kim, S. S.; Baba, M.; Yamamoto, T.; Lee, J.

ArticleIssue Date2015CitationINTERNATIONAL JOURNAL OF FATIGUE, v.73, pp 98 - 109PublisherELSEVIER SCI LTD
FOREIGN
S-N property and fatigue damage of ultrafine grained Cu smooth specimensopen access

Goto, M.; Han, S. Z.; Baba, M.; Ahn, J. H.; Kim, S.; Kitamura, J.

ArticleIssue Date2014Citation20TH EUROPEAN CONFERENCE ON FRACTURE, v.3, pp 524 - 530PublisherELSEVIER SCIENCE BV
SCIESCOPUS
Simultaneous increase in electrical conductivity and fatigue strength of Cu-Ni-Si alloy by utilizing discontinuous precipitates

Goto, M.; Yamamoto, T.; Han, S. Z.; Utsunomiya, T.; Kim, S.; Kitamura, J.; Ahn, J. H.; Lim, S. H.; Lee, J.

ArticleIssue Date2021CitationMaterials Letters, v.288PublisherElsevier BV
SCIESCOPUS
Stress-dependent opening- and shear-mode propagation behavior of fatigue cracks in ultrafine-grained Cu fabricated by equal channel angular pressing (vol 142, 105978, 2021)open access

Goto, M.; Yamamoto, T.; Han, S. Z.; Kim, S.; Kitamura, J.; Yakushiji, T.; Ahn, J. -H.; Takanami, R.; Utsunomiya, T.; Lee, J.

ArticleIssue Date2021CitationInternational Journal of Fatigue, v.144PublisherElsevier BV
SCISCIESCOPUS
The effect of microstructural inhomogeneity on the growth paths of surface-cracks in copper processed by equal channel angular pressing

Goto, M.; Ando, Y.; Han, S. Z.; Kim, S. S.; Kawagoishi, N.; Euh, K.

ArticleIssue Date2010CitationENGINEERING FRACTURE MECHANICS, v.77, no.11, pp 1914 - 1925PublisherPERGAMON-ELSEVIER SCIENCE LTD
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