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S-N property and fatigue damage of ultrafine grained Cu smooth specimensopen access
- Authors
- Goto, M.; Han, S. Z.; Baba, M.; Ahn, J. H.; Kim, S.; Kitamura, J.
- Issue Date
- 2014
- Publisher
- ELSEVIER SCIENCE BV
- Keywords
- Fatigue; Copper, Ultrafine grain; S-N curve; Crack propagation
- Citation
- 20TH EUROPEAN CONFERENCE ON FRACTURE, v.3, pp 524 - 530
- Pages
- 7
- Indexed
- FOREIGN
- Journal Title
- 20TH EUROPEAN CONFERENCE ON FRACTURE
- Volume
- 3
- Start Page
- 524
- End Page
- 530
- ISSN
- 2211-8128
- Abstract
- Fatigue tests were conducted using copper processed by equal channel angular pressing (ECAP) through 4, 8 and 12 pass numbers. At high and medium stress amplitudes, the largest fatigue life was attained in the specimens processed by 8 passes, whereas the smallest one was given in 12 passes. At low stress amplitudes, S-N curves tended to coincide with a specific value of stress amplitude regardless of pass numbers. The physical background of the effect of ECAP pass numbers on S-N property was discussed from the viewpoints of microstructure and surface damage formation. (C) 2014 Elsevier Ltd.
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