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Growth behavior of small surface cracks in coarse and ultrafine grained copperopen access

Authors
Goto, M.Han, S. Z.Ando, Y.Kawagoishi, N.Teshima, N.Kim, S. S.
Issue Date
2009
Publisher
WIT PRESS
Keywords
equal channel angular pressing; copper; ultrafine grain; fatigue; small surface-crack
Citation
COMPUTATIONAL METHODS AND EXPERIMENTAL MEASUREMENTS XIV, v.48, pp 497 - +
Indexed
SCIE
SCOPUS
Journal Title
COMPUTATIONAL METHODS AND EXPERIMENTAL MEASUREMENTS XIV
Volume
48
Start Page
497
End Page
+
URI
https://scholarworks.gnu.ac.kr/handle/sw.gnu/27149
DOI
10.2495/CMEM090451
ISSN
1746-4064
Abstract
Since fatigue life of a plain specimen of ductile metals is controlled mainly by the propagation life of a small surface crack, to clarify the growth behavior of a small crack is crucial to the safe design of smooth members. However, little has been reported on the growth behavior of small surface cracks in ultrafine grained (UFG) metals. In the present study, stress-controlled fatigue tests for coarse grained (CG) and UFG copper were conducted. The surface damage evolution during cyclic stressing was observed by optical microscopy, and the growth behavior of a small surface crack was monitored by a plastic replication technique. The physical background of fatigue damage for CG and UFG copper was discussed from the viewpoints of the initiation and growth behavior of small surface cracks.
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