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Radiation effect in FD-SOI nanowire FETs due to high dose rate gamma-ray under variable irradiation temperatures

Authors
Ha, JonghyeonSuh, MinkiRyu, MinsangLee, DabokJeon, Dae-YoungKim, Jungsik
Issue Date
Jan-2026
Publisher
Elsevier Ltd.
Keywords
TID effect; FD-SOI nanowire FET; Gamma-rays; Technology computer-aided design (TCAD)
Citation
Microelectronics and Reliability, v.176
Indexed
SCIE
SCOPUS
Journal Title
Microelectronics and Reliability
Volume
176
URI
https://scholarworks.gnu.ac.kr/handle/sw.gnu/81325
DOI
10.1016/j.microrel.2025.115957
ISSN
0026-2714
1872-941X
Abstract
In this study, the effects of gamma-ray irradiation on fully depleted silicon on insulator (FD-SOI) Nanowire FETs (NWFETs) at different irradiation temperatures (265, 300, and 400 K) were analyzed. For PMOS, positive threshold shift (dVth) owing to interface and oxide traps could be observed regardless of the irradiation temperature. However, NMOS showed a different temperature trend. At 400 K, the oxide traps were cured during annealing, enhancing the influence of interface traps and resulting in a positive dVth. In comparison, at 265 K, the oxide traps became more influential due to reduced hole mobility in the buried oxide (BOX), resulting in a negative dVth. Annealing was performed at room temperature for 24 and 168 h to investigate the dVth owing to the annealing effect (dVth-anneal). In NMOS, a positive dVth-anneal occurred regardless of width (W) as the oxide traps were cured by annealing. PMOS showed a negative dVth-anneal regardless of W.
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