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Cited 16 time in webofscience Cited 20 time in scopus
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Exploring Conductive Filler-Embedded Polymer Nanocomposite for Electrical Percolation via Electromagnetic Shielding-Based Additive Manufacturing

Authors
Qureshi, NilamDhand, VivekSubhani, ShaikKumar, Rajendran SenthilRaghavan, NagarajanKim, SanghoonDoh, Jaehyeok
Issue Date
Sep-2024
Publisher
JOHN WILEY & SONS INC
Keywords
additive manufacturing; conductive fillers; electrical percolation threshold; EMI shielding; nanocomposites
Citation
Advanced Materials Technologies, v.9, no.17
Indexed
SCIE
SCOPUS
Journal Title
Advanced Materials Technologies
Volume
9
Number
17
URI
https://scholarworks.gnu.ac.kr/handle/sw.gnu/70417
DOI
10.1002/admt.202400250
ISSN
2365-709X
2365-709X
Abstract
This review delves into the progress made in additive manufacturing through the incorporation of conductive fillers in nanocomposites. Emphasizing the critical role of percolation and conductivity, the study highlights advancements in material selection, particularly focusing on carbon nanotubes with low percolation thresholds. The practical applications of these nanocomposites in additive manufacturing polymer composites are explored, emphasizing the understanding of percolation thresholds. Furthermore, the present review paper investigates the potential of these materials as lightweight alternatives for electromagnetic interference shielding (EMI), particularly in key sectors such as automotive and aerospace industries. The integration of advanced materials, modeling techniques, and standardization is discussed as pivotal for successful implementation. Overall, the review underscores the significant strides in enhancing electrical properties and electromagnetic interference shielding capabilities through the strategic use of conductive filler nanocomposites in additive manufacturing. © 2024 The Authors. Advanced Materials Technologies published by Wiley-VCH GmbH.
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우주항공대학 (항공우주공학부)
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