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Cited 16 time in webofscience Cited 20 time in scopus
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Exploring Conductive Filler-Embedded Polymer Nanocomposite for Electrical Percolation via Electromagnetic Shielding-Based Additive Manufacturing

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dc.contributor.authorQureshi, Nilam-
dc.contributor.authorDhand, Vivek-
dc.contributor.authorSubhani, Shaik-
dc.contributor.authorKumar, Rajendran Senthil-
dc.contributor.authorRaghavan, Nagarajan-
dc.contributor.authorKim, Sanghoon-
dc.contributor.authorDoh, Jaehyeok-
dc.date.accessioned2024-04-30T02:30:14Z-
dc.date.available2024-04-30T02:30:14Z-
dc.date.issued2024-09-
dc.identifier.issn2365-709X-
dc.identifier.issn2365-709X-
dc.identifier.urihttps://scholarworks.gnu.ac.kr/handle/sw.gnu/70417-
dc.description.abstractThis review delves into the progress made in additive manufacturing through the incorporation of conductive fillers in nanocomposites. Emphasizing the critical role of percolation and conductivity, the study highlights advancements in material selection, particularly focusing on carbon nanotubes with low percolation thresholds. The practical applications of these nanocomposites in additive manufacturing polymer composites are explored, emphasizing the understanding of percolation thresholds. Furthermore, the present review paper investigates the potential of these materials as lightweight alternatives for electromagnetic interference shielding (EMI), particularly in key sectors such as automotive and aerospace industries. The integration of advanced materials, modeling techniques, and standardization is discussed as pivotal for successful implementation. Overall, the review underscores the significant strides in enhancing electrical properties and electromagnetic interference shielding capabilities through the strategic use of conductive filler nanocomposites in additive manufacturing. © 2024 The Authors. Advanced Materials Technologies published by Wiley-VCH GmbH.-
dc.language영어-
dc.language.isoENG-
dc.publisherJOHN WILEY & SONS INC-
dc.titleExploring Conductive Filler-Embedded Polymer Nanocomposite for Electrical Percolation via Electromagnetic Shielding-Based Additive Manufacturing-
dc.typeArticle-
dc.publisher.location미국-
dc.identifier.doi10.1002/admt.202400250-
dc.identifier.scopusid2-s2.0-85190603604-
dc.identifier.wosid001204855600001-
dc.identifier.bibliographicCitationAdvanced Materials Technologies, v.9, no.17-
dc.citation.titleAdvanced Materials Technologies-
dc.citation.volume9-
dc.citation.number17-
dc.type.docTypeReview-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.subject.keywordPlusCARBON-BLACK-
dc.subject.keywordPlusMECHANICAL-PROPERTIES-
dc.subject.keywordPlusCFRP STRUCTURES-
dc.subject.keywordPlusLIGHT WEIGHT-
dc.subject.keywordPlusCOMPOSITES-
dc.subject.keywordPlusPERFORMANCE-
dc.subject.keywordPlusTHRESHOLD-
dc.subject.keywordPlusGRAPHENE-
dc.subject.keywordPlusNANOTUBES-
dc.subject.keywordPlusBLENDS-
dc.subject.keywordAuthoradditive manufacturing-
dc.subject.keywordAuthorconductive fillers-
dc.subject.keywordAuthorelectrical percolation threshold-
dc.subject.keywordAuthorEMI shielding-
dc.subject.keywordAuthornanocomposites-
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우주항공대학 (항공우주공학부)
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