Aluminum Co-Deposition via DC Magnetron Sputtering for Enhanced Pitting Resistance of Copper-Nickel Alloysopen access
- Authors
- Yun, Sang-Du; Kim, Yeonwon; Lee, Jun-Seok; Noh, Jung-Pil; Kim, Beom-Soo; Kwon, Jae-Sung; Choi, Sung-Woong; Yang, Jeong-Hyeon
- Issue Date
- Jan-2024
- Publisher
- MDPI
- Keywords
- Al co-deposition; corrosion resistance; Cu-Ni alloy; magnetron sputtering; thin film
- Citation
- COATINGS, v.14, no.1
- Indexed
- SCIE
SCOPUS
- Journal Title
- COATINGS
- Volume
- 14
- Number
- 1
- URI
- https://scholarworks.gnu.ac.kr/handle/sw.gnu/69713
- DOI
- 10.3390/coatings14010132
- ISSN
- 2079-6412
2079-6412
- Abstract
- To investigate the improvements in the resistance of Cu-Ni alloys to surface pitting corrosion, Cu-Ni thin films containing Al were fabricated via DC magnetron sputtering. The morphologies of the fabricated samples were obtained using a scanning electron microscopy, which yielded information on the crystal size and sample surface before and after corrosion tests. X-ray diffraction was employed for the structural characterization of the as-deposited films, and vibrational spectroscopy was used to verify the corrosion products. The corrosion behaviors of the Cu-Ni and Cu-Ni-Al samples were examined using electrochemical polarization and cyclic corrosion tests. The Al co-deposited samples showed a refined crystal size as compared to the Cu-Ni sample, suggesting that they are more susceptible to the formation of a passivation film. The corrosion current density of the Cu-Ni-Al was reduced, and the corrosion potential was lower than that without Al content. The negative shift in the corrosion potential of the Al-containing samples indicates that the Al2O3 film suppressed the cathodic reaction, resulting in a decrease in the corrosion rate. These results are consistent with the cyclic corrosion test results, in which no pitting corrosion is observed in the Cu-Ni-Al sample.
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