Machine Learning Approach for Prediction of Point Defect Effect in FinFET
- Authors
- Kim, Jungsik; Kim, Sun Jin; Han, Jin-Woo; Meyyappan, M.
- Issue Date
- Jun-2021
- Publisher
- IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
- Keywords
- Machine learning; FinFET; TCAD; simulation; point defect
- Citation
- IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, v.21, no.2, pp 252 - 257
- Pages
- 6
- Indexed
- SCIE
SCOPUS
- Journal Title
- IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
- Volume
- 21
- Number
- 2
- Start Page
- 252
- End Page
- 257
- URI
- https://scholarworks.gnu.ac.kr/handle/sw.gnu/3675
- DOI
- 10.1109/TDMR.2021.3069720
- ISSN
- 1530-4388
1558-2574
- Abstract
- As Fin Field Effect Transistor (FinFET) scales aggressively, even a single point defect becomes a source of performance variability. The point defect is inevitably introduced not only by process damage such as epitaxial growth and ion implantation but also by cosmic rays. Technology computer-aided design (TCAD) is able to simulate the characteristics of the device with the defect. In this work, a machine learning algorithm is tested if it can reproduce the TCAD results. The impact of point defect in bulk FinFET is used as test vehicle to validate the machine-learning algorithm. TCAD is used first to generate a massive number of current-voltage characteristics dataset. The TCAD dataset is then exclusively divided into groups for machine learning training, validation and test. The trained model provides high accuracy test results within 1 % error, showing the possibility to expedite failure analysis cycle via machine learning.
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