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Cited 20 time in webofscience Cited 23 time in scopus
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Machine Learning Approach for Prediction of Point Defect Effect in FinFET

Authors
Kim, JungsikKim, Sun JinHan, Jin-WooMeyyappan, M.
Issue Date
Jun-2021
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Keywords
Machine learning; FinFET; TCAD; simulation; point defect
Citation
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, v.21, no.2, pp 252 - 257
Pages
6
Indexed
SCIE
SCOPUS
Journal Title
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
Volume
21
Number
2
Start Page
252
End Page
257
URI
https://scholarworks.gnu.ac.kr/handle/sw.gnu/3675
DOI
10.1109/TDMR.2021.3069720
ISSN
1530-4388
1558-2574
Abstract
As Fin Field Effect Transistor (FinFET) scales aggressively, even a single point defect becomes a source of performance variability. The point defect is inevitably introduced not only by process damage such as epitaxial growth and ion implantation but also by cosmic rays. Technology computer-aided design (TCAD) is able to simulate the characteristics of the device with the defect. In this work, a machine learning algorithm is tested if it can reproduce the TCAD results. The impact of point defect in bulk FinFET is used as test vehicle to validate the machine-learning algorithm. TCAD is used first to generate a massive number of current-voltage characteristics dataset. The TCAD dataset is then exclusively divided into groups for machine learning training, validation and test. The trained model provides high accuracy test results within 1 % error, showing the possibility to expedite failure analysis cycle via machine learning.
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Kim, Jung Sik
IT공과대학 (전기공학과)
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