Cited 23 time in
Machine Learning Approach for Prediction of Point Defect Effect in FinFET
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Jungsik | - |
| dc.contributor.author | Kim, Sun Jin | - |
| dc.contributor.author | Han, Jin-Woo | - |
| dc.contributor.author | Meyyappan, M. | - |
| dc.date.accessioned | 2022-12-26T10:16:15Z | - |
| dc.date.available | 2022-12-26T10:16:15Z | - |
| dc.date.issued | 2021-06 | - |
| dc.identifier.issn | 1530-4388 | - |
| dc.identifier.issn | 1558-2574 | - |
| dc.identifier.uri | https://scholarworks.gnu.ac.kr/handle/sw.gnu/3675 | - |
| dc.description.abstract | As Fin Field Effect Transistor (FinFET) scales aggressively, even a single point defect becomes a source of performance variability. The point defect is inevitably introduced not only by process damage such as epitaxial growth and ion implantation but also by cosmic rays. Technology computer-aided design (TCAD) is able to simulate the characteristics of the device with the defect. In this work, a machine learning algorithm is tested if it can reproduce the TCAD results. The impact of point defect in bulk FinFET is used as test vehicle to validate the machine-learning algorithm. TCAD is used first to generate a massive number of current-voltage characteristics dataset. The TCAD dataset is then exclusively divided into groups for machine learning training, validation and test. The trained model provides high accuracy test results within 1 % error, showing the possibility to expedite failure analysis cycle via machine learning. | - |
| dc.format.extent | 6 | - |
| dc.language | 영어 | - |
| dc.language.iso | ENG | - |
| dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
| dc.title | Machine Learning Approach for Prediction of Point Defect Effect in FinFET | - |
| dc.type | Article | - |
| dc.publisher.location | 미국 | - |
| dc.identifier.doi | 10.1109/TDMR.2021.3069720 | - |
| dc.identifier.scopusid | 2-s2.0-85103787065 | - |
| dc.identifier.wosid | 000659548400012 | - |
| dc.identifier.bibliographicCitation | IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, v.21, no.2, pp 252 - 257 | - |
| dc.citation.title | IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY | - |
| dc.citation.volume | 21 | - |
| dc.citation.number | 2 | - |
| dc.citation.startPage | 252 | - |
| dc.citation.endPage | 257 | - |
| dc.type.docType | Article | - |
| dc.description.isOpenAccess | N | - |
| dc.description.journalRegisteredClass | scie | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.relation.journalResearchArea | Engineering | - |
| dc.relation.journalResearchArea | Physics | - |
| dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
| dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
| dc.subject.keywordPlus | VARIABILITY | - |
| dc.subject.keywordAuthor | Machine learning | - |
| dc.subject.keywordAuthor | FinFET | - |
| dc.subject.keywordAuthor | TCAD | - |
| dc.subject.keywordAuthor | simulation | - |
| dc.subject.keywordAuthor | point defect | - |
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