Electrical properties of semiconducting YBa2Cu3O7-x thin film with variation of oxygen partial pressure
- Authors
- Jeong, Jae-Woon; Lee, Sung-Gap; Jo, Seo-Hyeon; Kim, Dae-Young; Lee, Tae-Ho
- Issue Date
- Aug-2013
- Publisher
- KOREAN ASSOC CRYSTAL GROWTH, INC
- Keywords
- YBCO; Thin film; Sol-gel
- Citation
- JOURNAL OF CERAMIC PROCESSING RESEARCH, v.14, no.4, pp 573 - 576
- Pages
- 4
- Indexed
- SCI
SCIE
SCOPUS
KCI
- Journal Title
- JOURNAL OF CERAMIC PROCESSING RESEARCH
- Volume
- 14
- Number
- 4
- Start Page
- 573
- End Page
- 576
- URI
- https://scholarworks.gnu.ac.kr/handle/sw.gnu/20563
- ISSN
- 1229-9162
2672-152X
- Abstract
- YBa2Cu3O7-x (YBCO) is the material of choice for second-generation superconducting wires and is the only current option for critical current density (J(c))> 1 MA/cm(2) at 77 K [1]. YBCO belongs to a class of copper oxides well known for their superconducting properties. Its conduction properties can be changed from metallic (0.5 < x < 1) to insulating (0x0.5) by suitably decreasing the oxygen content [2]. The structural, electrical and optical properties of YBa2Cu3O7-x can be varied by adjusting the oxygen content x [3, 4]. As x is decreased to 0.5, the crystal undergoes a phase transition to a tetragonal structure and it exhibits semiconducting conductivity characteristics as it exists in a Fermi glass state. YBCO precursor solutions were prepared by the sol-gel method YBCO films were fabricated by the spin coating method, and structural and its electrical were studied at various oxygen partial pressures. The films Ar/O-2 at 7 : 3 showed the more obvious YBa2Cu3O7-x phase and tetragonal phase. The thickness of all the films was approximately 0.23 similar to 0.31 mu m and the average grain size of the YBCO film Ar/O-2 at 7 : 3 was about 50 nm. Temperature resistance coefficient (TCR), responsivity, and detectivity of the YBCO film Ar/O-2 at 7 : 3 were 3.2%/K at room temperature, 14.72 V/W, and 2.27 cmHz1/2/W, respectively.
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Collections - 공학계열 > Dept.of Materials Engineering and Convergence Technology > Journal Articles

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