Improvement of Fermi-Level Pinning and Contact Resistivity in Ti/Ge Contact Using Carbon Implantationopen access
- Park, Iksoo; Lee, Donghun; Jin, Bo; Kim, Jungsik; Lee, Jeong-Soo
- Issue Date
- MS contact; fermi-level pinning; titanium; germanide; carbon; implantation
- MICROMACHINES, v.13, no.1
- Journal Title
- Effects of carbon implantation (C-imp) on the contact characteristics of Ti/Ge contact were investigated. The C-imp into Ti/Ge system was developed to reduce severe Fermi-level pinning (FLP) and to improve the thermal stability of Ti/Ge contact. The current density (J)-voltage (V) characteristics showed that the rectifying behavior of Ti/Ge contact into an Ohmic-like behavior with C-imp. The lowering of Schottky barrier height (SBH) indicated that the C-imp could mitigate FLP. In addition, it allows a lower specific contact resistivity (rho(c)) at the rapid thermal annealing (RTA) temperatures in a range of 450-600 degrees C. A secondary ion mass spectrometry (SIMS) showed that C-imp facilitates the dopant segregation at the interface. In addition, transmission electron microscopy (TEM) and electron energy loss spectroscopy (EELS) mapping showed that after RTA at 600 degrees C, C-imp enhances the diffusion of Ge atoms into Ti layer at the interface of Ti/Ge. Thus, carbon implantation into Ge substrate can effectively reduce FLP and improve contact characteristics.
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- 공과대학 > 전기공학과 > Journal Articles
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