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Microstructural evaluation and failure analysis of Ag wire bonded to Al pads
- Authors
- Choi, Mi-Ri; Kim, Hyung-Giun; Lee, Taeg-Woo; Jeon, Young-Jun; Ahn, Yong-Keun; Koo, Kyo-Wang; Jang, You-Cheol; Park, So-Yeon; Yee, Jae-Hak; Cho, Nam-Kwon; Kang, Il-Tae; Kim, Sangshik; Han, Seung-Zeon; Lim, Sung-Hwan
- Issue Date
- Nov-2015
- Publisher
- PERGAMON-ELSEVIER SCIENCE LTD
- Keywords
- Silver wire bonding; Failure mechanism; Interfacial microstructure; Intermetallic compound; Transmission electron microscopy
- Citation
- MICROELECTRONICS RELIABILITY, v.55, no.11, pp 2306 - 2315
- Pages
- 10
- Indexed
- SCI
SCIE
SCOPUS
- Journal Title
- MICROELECTRONICS RELIABILITY
- Volume
- 55
- Number
- 11
- Start Page
- 2306
- End Page
- 2315
- ISSN
- 0026-2714
- Abstract
- We found the failure mechanisms in Ag wire bonded to Al pads during the high-temperature-storage lifetime test (HTST) and the unbiased highly-accelerated temperature and humidity storage test (uHAST). The native oxide layer on the Al pads caused a ball lift The moisture and the thermal energy during uHAST along with the Cl- ion in epoxy molding compounds (EMCs) induced repetitive oxidation and reduction reactions of the Ag-Al intermetallic compounds (IMCs) with the Al pads. These repetitive reactions formed H-2 gas as a by-product causing the formation of a micro-crack. In addition, the alumina layer acted as a resistive layer in the Ag-Al IMCs. The phases of the Ag-Al IMCs were identified as Ag2Al and Ag3Al, and the growth rates of those IMCs were measured at 150 and 175 degrees C for 2000 h. (C) 2015 Elsevier Ltd. All rights reserved.
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