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SCIESCOPUS
Aluminum Co-Deposition via DC Magnetron Sputtering for Enhanced Pitting Resistance of Copper-Nickel Alloys

Yun, Sang-Du; Kim, Yeonwon; Lee, Jun-Seok; Noh, Jung-Pil; Kim, Beom Soo; Kwon, Jae-Sung; Choi, Sung-Woong; Yang, Jeong-Hyeon

ArticleIssue Date2024CitationCoatings, v.14, no.1PublisherMDPI AG
SCIESCOPUS
Electrochemical Properties of Multilayered Sn/TiNi Shape-Memory-Alloy Thin-Film Electrodes for High-Performance Anodes in Li-Ion Batteriesopen access

Seo, Duck-Hyeon; Lee, Jun-Seok; Yun, Sang-Du; Yang, Jeong-Hyeon; Huh, Sun-Chul; Sung, Yon-Mo; Jeong, Hyo-Min; Noh, Jung-Pil

ArticleIssue Date2022CitationMaterials, v.15, no.7PublisherMDPI Open Access Publishing
SCIESCOPUS
Free-Standing Li4Ti5O12/Carbon Nanotube Electrodes for Flexible Lithium-Ion Batteriesopen access

Lee, Jun-Seok; Yun, Sang-Du; Nyamaa, Oyunbayar; Yang, Jeong-Hyeon; Huh, Sun-Chul; Jeong, Hyo-Min; Nam, Tae-Hyun; Ryu, Yeon-Ju; Noh, Jung-Pil

ArticleIssue Date2022CitationEnergies, v.15, no.22PublisherMultidisciplinary Digital Publishing Institute (MDPI)
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