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Growth behavior of small surface cracks in coarse and ultrafine grained copperopen access

Goto, M.; Han, S. Z.; Ando, Y.; Kawagoishi, N.; Teshima, N.; Kim, S. S.

ArticleIssue Date2009CitationCOMPUTATIONAL METHODS AND EXPERIMENTAL MEASUREMENTS XIV, v.48, pp 497 - +PublisherWIT PRESS
SCISCIESCOPUS
High-cycle fatigue strength and small-crack growth behavior of ultrafine-grained copper with post-ECAP annealing

Goto, M.; Teshima, N.; Han, S. Z.; Euh, K.; Yakushiji, T.; Kim, S. S.; Lee, J.

ArticleIssue Date2013CitationENGINEERING FRACTURE MECHANICS, v.110, pp 218 - 232PublisherPERGAMON-ELSEVIER SCIENCE LTD
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