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Aluminum Co-Deposition via DC Magnetron Sputtering for Enhanced Pitting Resistance of Copper-Nickel Alloys

Yun, Sang-Du; Kim, Yeonwon; Lee, Jun-Seok; Noh, Jung-Pil; Kim, Beom Soo; Kwon, Jae-Sung; Choi, Sung-Woong; Yang, Jeong-Hyeon

ArticleIssue Date2024CitationCoatings, v.14, no.1PublisherMDPI AG
SCIESCOPUSKCI
Enhancement of the electroactive beta phase in electrospun PVDF fibers by incorporation of CaCO3-based Cu hybrid particles prepared using plasma-liquid electrochemical synthesis

Kim, Yeonwon; Yang, Jeonghyeon

ArticleIssue Date2021CitationJournal of the Korean Physical Society, v.78, no.1, pp 27 - 33Publisher한국물리학회
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