Process Optimization of Activated Carbon Fiber Using Response Surface Methodology
- Authors
- Shin, Hae-Reum; Yeo, Seung-Jun; Kim, Jong-Hyun; Lee, Donghyeon; Park, Beomjin; Kwon, Dong-Jun; Kim, Mantae
- Issue Date
- Nov-2025
- Publisher
- 한국섬유공학회
- Keywords
- Activated carbon fiber; Activation yield; Process optimization; Response surface methodology; Specific surface area
- Citation
- Fibers and Polymers, v.26, no.11, pp 4737 - 4751
- Pages
- 15
- Indexed
- SCIE
SCOPUS
KCI
- Journal Title
- Fibers and Polymers
- Volume
- 26
- Number
- 11
- Start Page
- 4737
- End Page
- 4751
- URI
- https://scholarworks.gnu.ac.kr/handle/sw.gnu/79951
- DOI
- 10.1007/s12221-025-01145-2
- ISSN
- 1229-9197
1875-0052
- Abstract
- Response Surface Methodology (RSM) was employed to optimize the activation yield (%) and specific surface area (m2/g) in the manufacture of activated carbon fibers. Isotropic petroleum pitch was melt‑blown into non‑woven webs (~ 25 µm), then stabilized (280 ℃, air), carbonized (800 ℃, N2), and steam‑activated (800–900 ℃) as discrete steps. A Box-Behnken Design (BBD) that encoded eight process variables spanning stabilization, carbonization, and activation generated a second-order polynomial model (R2 = 0.969 for yield and 0.918 for surface area). According to the RSM model, the key process variable for achieving a high activation yield was the stabilization holding time, with optimal results observed at 1 h. The main process variable for maximizing the specific surface area was the activation temperature, with the optimum value being 900 ℃. Validation under the predicted optimum (900 ℃, 1.2 g/min steam, 45 min) produced ACFs with 34.6 wt. % yield and 2,429.5 m2/g surface area, confirming the model’s predictive accuracy. These results confirm that RSM offers a statistically robust route to tailoring pitch-based activated carbon fibers (ACF) for high-performance adsorption applications.
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Collections - 자연과학대학 > Dept. of Information and Statistics > Journal Articles
- 공학계열 > Dept.of Materials Engineering and Convergence Technology > Journal Articles

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