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Impact of Displacement Defect Owing to Cosmic Rays on Three-Nanometer-Node Nanosheet FET 6T Static Random Access Memory

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dc.contributor.authorHa, Jonghyeon-
dc.contributor.authorBang, Minji-
dc.contributor.authorLee, Gyeongyeop-
dc.contributor.authorSuh, Minki-
dc.contributor.authorKim, Chong-Eun-
dc.contributor.authorKim, Jungsik-
dc.date.accessioned2023-10-06T02:41:02Z-
dc.date.available2023-10-06T02:41:02Z-
dc.date.issued2023-09-
dc.identifier.issn2169-3536-
dc.identifier.urihttps://scholarworks.gnu.ac.kr/handle/sw.gnu/68057-
dc.description.abstractIn this work, the effect of displacement defect (DD) owing to cosmic rays on six-transistor (6T) static random access memory (SRAM) with a 3 nm node nanosheet field-effect transistor (NSFET) is investigated using technology computer-aided design (TCAD) simulation. In order to comprehensively study the uncertainty of the radiation of NSFET 6T SRAM, the shape of the DD cluster cross-section and the transistor damaged by the DD in 6T SRAM are considered. Read static noise margin (RSNM) degradation (19 %) is the highest when the rectangular cross-section of the DD cluster (rectangular-DD cluster) is located in the pull-down1 (PD1) transistor. To mitigate the rectangular-DD cluster damage, we studied the variation in the DD cluster influence on the sheet shape and the source/drain (S/D) overlap length fluctuation. The sheet shape resulted in 2.3 % lower RSNM degradation in NS compared with nanowire (NW). Under the worst conditions (PD1 transistor damaged rectangular-DD cluster, NW structure), the S/D underlap structure showed 3.7 % lower RSNM degradation than the S/D overlap structure. © 2013 IEEE.-
dc.format.extent7-
dc.language영어-
dc.language.isoENG-
dc.publisherInstitute of Electrical and Electronics Engineers Inc.-
dc.titleImpact of Displacement Defect Owing to Cosmic Rays on Three-Nanometer-Node Nanosheet FET 6T Static Random Access Memory-
dc.typeArticle-
dc.publisher.location미국-
dc.identifier.doi10.1109/ACCESS.2023.3312016-
dc.identifier.scopusid2-s2.0-85171587957-
dc.identifier.wosid001068806000001-
dc.identifier.bibliographicCitationIEEE Access, v.11, pp 97682 - 97688-
dc.citation.titleIEEE Access-
dc.citation.volume11-
dc.citation.startPage97682-
dc.citation.endPage97688-
dc.type.docTypeArticle-
dc.description.isOpenAccessY-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaComputer Science-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaTelecommunications-
dc.relation.journalWebOfScienceCategoryComputer Science, Information Systems-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.relation.journalWebOfScienceCategoryTelecommunications-
dc.subject.keywordAuthorDisplacement defect (DD)-
dc.subject.keywordAuthornanosheet FET (NSFET)-
dc.subject.keywordAuthorradiation effects-
dc.subject.keywordAuthorreliability-
dc.subject.keywordAuthorstatic random access memory (SRAM)-
dc.subject.keywordAuthortechnology computer-aided design simulation (TCAD)-
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