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Multifunctional heating film as susceptor for induction-welded single-lap carbon fiber reinforced polyetherketoneketone thermoplastic composite joints: Thermal and mechanical behavior

Authors
Hoang, Van-ThoLee, Dae-SungKweon, Jin-HweKwak, Byeong-SuNam, Young-Woo
Issue Date
Sep-2024
Publisher
SAGE Publications
Keywords
Induction welding; susceptor; thermal and mechanical performance; thermoplastic composite
Citation
Journal of Reinforced Plastics and Composites, v.43, no.17-18, pp 980 - 994
Pages
15
Indexed
SCIE
SCOPUS
Journal Title
Journal of Reinforced Plastics and Composites
Volume
43
Number
17-18
Start Page
980
End Page
994
URI
https://scholarworks.gnu.ac.kr/handle/sw.gnu/67978
DOI
10.1177/07316844231198309
ISSN
0731-6844
1530-7964
Abstract
In this study, a novel multifunctional film known as susceptor, containing silver nanoparticles, was proposed to improve the induction welding performance of unidirectional carbon fiber-reinforced polyetherketoneketone (CF/PEKK) thermoplastic composites. A group of Ag/PEKK films was synthesized with different amounts of silver nanoparticles. Good thermal performance was obtained, including the maximum temperature and thermal growth time constant, leading to the selection of films with 60 wt.% and 70 wt.% silver nanoparticles. In addition, the mechanical performance was evaluated for single-lap joints fabricated with the selected films and stainless-steel mesh. Specifically, the highest interlaminar shear strength and single-lap shear strength of 25.2 MPa and 20.9 MPa, respectively, were achieved with a susceptor containing 60 wt.% silver nanoparticles. The mechanism of these increases in thermal and mechanical performance is discussed using numerical and experimental methods (non-destructive test and optical microscope observation). In conclusion, the multifunctional heating film incorporated into the adhesive can improve the thermal and mechanical efficiency of single-lap joints of thermoplastic composites fabricated using the induction welding method. © The Author(s) 2023.
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