INTERFACIAL EVALUATION OF UD-CFRP BY THERMAL AGING VIA ACOUSTIC EMISSION, ELECTRICAL RESISTANCE AND THERMOGRAM METHODS

박종만

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INTERFACIAL EVALUATION OF UD-CFRP BY THERMAL AGING VIA ACOUSTIC EMISSION, ELECTRICAL RESISTANCE AND THERMOGRAM METHODS

Authors: 박종만

Issue Date: 22-Aug-2017

Publisher: ICCM

Citation: ICCM 21

URI: https://scholarworks.gnu.ac.kr/handle/sw.gnu/61737

Conference Name: ICCM 21

Place: CN
Xi`an, China

Conference Date: 2017-08-20

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Appears in Collections: ETC > Conference Papers

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