Room temperature processed protective layer for printed silver electrodesopen access
- Authors
- Kim, Chungil; Park, Jin Ho; Ko, Jaehwan; Lee, Suwoon; Kwon, Ri Gyeong; Lee, Subin; Lee, Hangil; Kim, Jun Young; Song, Hyung-Jun
- Issue Date
- Jul-2023
- Publisher
- Royal Society of Chemistry
- Citation
- RSC Advances, v.13, no.30, pp 20557 - 20564
- Pages
- 8
- Indexed
- SCIE
SCOPUS
- Journal Title
- RSC Advances
- Volume
- 13
- Number
- 30
- Start Page
- 20557
- End Page
- 20564
- URI
- https://scholarworks.gnu.ac.kr/handle/sw.gnu/59952
- DOI
- 10.1039/d3ra02212a
- ISSN
- 2046-2069
2046-2069
- Abstract
- Low-temperature processed printed silver electrodes pave the way for electrical connections in flexible substrates with reduced energy consumption. Despite their excellent performance and simple process, printed silver electrodes' poor stability limits their applications. This study demonstrates a transparent protective layer without thermal annealing for printed silver electrodes, which maintains its electrical properties for a long period of time. A fluoropolymer, specifically a cyclic transparent optical polymer (CYTOP), was used as a protective layer for silver. The CYTOP is room temperature processable and chemically stable against carboxyl acid. The introduction of the CYTOP film on the printed silver electrodes mitigates the chemical reaction between silver and carboxyl acid, thereby elongating its lifetime. Under heated acetic acid, the printed silver electrodes with a CYTOP protective layer maintained their initial resistance for up to 300 hours, while the electrodes without a protective layer were damaged within a few hours. A microscopic image shows that the protective layer enables printed electrodes to maintain their shape without damage. Hence, the protective layer guarantees the accurate and reliable performance of electronic devices with printed electrodes under actual operating conditions. This research will contribute to designing chemically reliable flexible devices in the near future.
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Collections - 공학계열 > 반도체공학과 > Journal Articles

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