Room Temperature Wafer-Scale Synthesis of Highly Transparent, Conductive CuS Nanosheet Films via a Simple Sulfur Adsorption-Corrosion Method
- Authors
- Hong, J.; Kim, B.-S.; Hou, B.; Pak, S.; Kim, T.; Jang, A.-R.; Cho, Y.; Lee, S.; An, G.-H.; Jang, J.E.; Morris, S.M.; Sohn, J.I.; Cha, S.
- Issue Date
- Jan-2021
- Publisher
- American Chemical Society
- Keywords
- adsorption isotherm; flexible electronics; scalable fabrication; transition metal sulfide; transparent conductive electrodes; vapor corrosion
- Citation
- ACS Applied Materials and Interfaces, v.13, no.3, pp 4244 - 4252
- Pages
- 9
- Indexed
- SCIE
SCOPUS
- Journal Title
- ACS Applied Materials and Interfaces
- Volume
- 13
- Number
- 3
- Start Page
- 4244
- End Page
- 4252
- URI
- https://scholarworks.gnu.ac.kr/handle/sw.gnu/5491
- DOI
- 10.1021/acsami.0c21957
- ISSN
- 1944-8244
1944-8252
- Abstract
- The development of highly conductive electrodes with robust mechanical durability and clear transmittance in the visible to IR spectral range is of great importance for future wearable/flexible electronic applications. In particular, low resistivity, robust flexibility, and wide spectral transparency have a significant impact on optoelectronic performance. Herein, we introduce a new class of covellite copper monosulfide (CuS) nanosheet films as a promising candidate for soft transparent conductive electrodes (TCEs). An atmospheric sulfur adsorption-corrosion phenomenon represents a key approach in our work for the achievement of wafer-scale CuS nanosheet films through systematic control of the neat Cu layer thickness ranging from 2 to 10 nm multilayers at room temperature. These nanosheet films provide outstanding conductivity (∼25 ω sq-1) and high transparency (> 80%) in the visible to infrared region as well as distinct flexibility and long stability under air exposure, yielding a high figure-of-merit (∼60) that is comparable to that of conventional rigid metal oxide material-based TCEs. Our unique room temperature synthesis process delivers high quality CuS nanosheets on any arbitrary substrates in a short time (< 1 min) scale, thus guaranteeing the widespread use of highly producible and scalable device fabrication. ?
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