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Cited 25 time in webofscience Cited 26 time in scopus
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Room Temperature Wafer-Scale Synthesis of Highly Transparent, Conductive CuS Nanosheet Films via a Simple Sulfur Adsorption-Corrosion Method

Authors
Hong, J.Kim, B.-S.Hou, B.Pak, S.Kim, T.Jang, A.-R.Cho, Y.Lee, S.An, G.-H.Jang, J.E.Morris, S.M.Sohn, J.I.Cha, S.
Issue Date
Jan-2021
Publisher
American Chemical Society
Keywords
adsorption isotherm; flexible electronics; scalable fabrication; transition metal sulfide; transparent conductive electrodes; vapor corrosion
Citation
ACS Applied Materials and Interfaces, v.13, no.3, pp 4244 - 4252
Pages
9
Indexed
SCIE
SCOPUS
Journal Title
ACS Applied Materials and Interfaces
Volume
13
Number
3
Start Page
4244
End Page
4252
URI
https://scholarworks.gnu.ac.kr/handle/sw.gnu/5491
DOI
10.1021/acsami.0c21957
ISSN
1944-8244
1944-8252
Abstract
The development of highly conductive electrodes with robust mechanical durability and clear transmittance in the visible to IR spectral range is of great importance for future wearable/flexible electronic applications. In particular, low resistivity, robust flexibility, and wide spectral transparency have a significant impact on optoelectronic performance. Herein, we introduce a new class of covellite copper monosulfide (CuS) nanosheet films as a promising candidate for soft transparent conductive electrodes (TCEs). An atmospheric sulfur adsorption-corrosion phenomenon represents a key approach in our work for the achievement of wafer-scale CuS nanosheet films through systematic control of the neat Cu layer thickness ranging from 2 to 10 nm multilayers at room temperature. These nanosheet films provide outstanding conductivity (∼25 ω sq-1) and high transparency (> 80%) in the visible to infrared region as well as distinct flexibility and long stability under air exposure, yielding a high figure-of-merit (∼60) that is comparable to that of conventional rigid metal oxide material-based TCEs. Our unique room temperature synthesis process delivers high quality CuS nanosheets on any arbitrary substrates in a short time (< 1 min) scale, thus guaranteeing the widespread use of highly producible and scalable device fabrication. ?
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