Optimizing interlayer cooling for SUS316L thin wall fabricated by directed energy depositionopen access
- Authors
- Hwang, S.; Oh, W.-J.; Kim, D.-H.; Kim, J.G.; Oh, J.S.; Nam, T.-H.; Kim, C.-S.; Lee, T.
- Issue Date
- Mar-2023
- Publisher
- Elsevier Editora Ltda
- Keywords
- Constitutive equation; Directed energy deposition; Geometric stability; Interlayer cooling; Microstructure; Stainless steel
- Citation
- Journal of Materials Research and Technology, v.23, pp.5239 - 5245
- Indexed
- SCIE
SCOPUS
- Journal Title
- Journal of Materials Research and Technology
- Volume
- 23
- Start Page
- 5239
- End Page
- 5245
- URI
- https://scholarworks.gnu.ac.kr/handle/sw.gnu/30163
- DOI
- 10.1016/j.jmrt.2023.02.145
- ISSN
- 2238-7854
- Abstract
- The direct energy deposition (DED) process requires proper interlayer cooling (IC) to avoid geometric failure caused by overheating of the midsection. This study suggests an optimum IC step based on a constitutive equation, instead of trial and error, to ensure the geometric stability of DED-processed 316 L stainless steel within a short period. The temperatures after cooling (TC) were acquired per layer of building and precisely measured using a constitutive model. Subsequently, a cooling period to maintain a target TC was calculated for the 30-layered DED specimen using the model. The optimum IC step varied with the number of deposited layers: (i) non-IC up to the fourth layer, (ii) IC step of 1.05 s for the fifth layer, and (iii) IC step of 2.21 s for the subsequent layers. The developed approach resulted in a remarkable improvement in geometric stability (geometric error of 5.9%) compared with the DED specimen fabricated without an IC step (error of 33.5%). Furthermore, the processing time was reduced by 30% compared with a conventional IC step with a fixed interval of 5 s. The developed approach also led to homogeneous grain refinement and a resulting increase in microhardness. © 2023 The Authors
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