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Crystallization behavior of Ti-(50-x)Ni-xCu(at%) (x = 20-30) alloy ribbonsopen access
- Authors
- Kim, M.-S.; Jeon, Y.-M.; Im, Y.-M.; Lee, Y.-H.; Nam, T.-H.
- Issue Date
- 2011
- Keywords
- Calorimetry; Diffraction; Intermatallics; Martensitic transformation; Rapid solidification processing
- Citation
- Transactions on Electrical and Electronic Materials, v.12, no.1, pp 20 - 23
- Pages
- 4
- Indexed
- SCOPUS
KCI
- Journal Title
- Transactions on Electrical and Electronic Materials
- Volume
- 12
- Number
- 1
- Start Page
- 20
- End Page
- 23
- ISSN
- 1229-7607
2092-7592
- Abstract
- Amorphous Ti-(50-x)Ni-xCu (at%) (x = 20, 25, 27, 30) alloy ribbons were prepared by melt spinning. Subsequently, the crystallization behavior of the alloy ribbons was investigated by X-ray diffraction and differential scanning calorimetry. ΔT (the temperature gap between Tg and Tx) increased from 33 K to 47 K and the wavenumber (Qp) decreased from 29.44 nm-1 to 29.29 nm-1 with increasing Cu content from 20 at% to 30 at%. The activation energy for crystallization decreased from 188.5 kJ/mol to 170.6 kJ/mol with increasing Cu content from 20 at% to 25 at%; afterwards, the activation energy remained near constant. Crystallization occurred in two-stage: amorphous-B2-TiCu2 in Ti-Ni-Cu alloys with Cu content less than 25 at%, while it occurred in three-stage; amorphous-B2-TiCu-TiCu2 in Ti-Ni-Cu alloys with Cu content more than 27 at%. ? 2011 KIEEME. All rights reserved.
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