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Crystallization behavior of Ti-(50-x)Ni-xCu(at%) (x = 20-30) alloy ribbons
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, M.-S. | - |
| dc.contributor.author | Jeon, Y.-M. | - |
| dc.contributor.author | Im, Y.-M. | - |
| dc.contributor.author | Lee, Y.-H. | - |
| dc.contributor.author | Nam, T.-H. | - |
| dc.date.accessioned | 2022-12-27T03:52:29Z | - |
| dc.date.available | 2022-12-27T03:52:29Z | - |
| dc.date.issued | 2011 | - |
| dc.identifier.issn | 1229-7607 | - |
| dc.identifier.issn | 2092-7592 | - |
| dc.identifier.uri | https://scholarworks.gnu.ac.kr/handle/sw.gnu/24712 | - |
| dc.description.abstract | Amorphous Ti-(50-x)Ni-xCu (at%) (x = 20, 25, 27, 30) alloy ribbons were prepared by melt spinning. Subsequently, the crystallization behavior of the alloy ribbons was investigated by X-ray diffraction and differential scanning calorimetry. ΔT (the temperature gap between Tg and Tx) increased from 33 K to 47 K and the wavenumber (Qp) decreased from 29.44 nm-1 to 29.29 nm-1 with increasing Cu content from 20 at% to 30 at%. The activation energy for crystallization decreased from 188.5 kJ/mol to 170.6 kJ/mol with increasing Cu content from 20 at% to 25 at%; afterwards, the activation energy remained near constant. Crystallization occurred in two-stage: amorphous-B2-TiCu2 in Ti-Ni-Cu alloys with Cu content less than 25 at%, while it occurred in three-stage; amorphous-B2-TiCu-TiCu2 in Ti-Ni-Cu alloys with Cu content more than 27 at%. ? 2011 KIEEME. All rights reserved. | - |
| dc.format.extent | 4 | - |
| dc.language | 영어 | - |
| dc.language.iso | ENG | - |
| dc.title | Crystallization behavior of Ti-(50-x)Ni-xCu(at%) (x = 20-30) alloy ribbons | - |
| dc.type | Article | - |
| dc.publisher.location | 대한민국 | - |
| dc.identifier.doi | 10.4313/TEEM.2011.12.1.20 | - |
| dc.identifier.scopusid | 2-s2.0-79960677393 | - |
| dc.identifier.bibliographicCitation | Transactions on Electrical and Electronic Materials, v.12, no.1, pp 20 - 23 | - |
| dc.citation.title | Transactions on Electrical and Electronic Materials | - |
| dc.citation.volume | 12 | - |
| dc.citation.number | 1 | - |
| dc.citation.startPage | 20 | - |
| dc.citation.endPage | 23 | - |
| dc.type.docType | Article | - |
| dc.identifier.kciid | ART001534176 | - |
| dc.description.isOpenAccess | Y | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.description.journalRegisteredClass | kci | - |
| dc.subject.keywordAuthor | Calorimetry | - |
| dc.subject.keywordAuthor | Diffraction | - |
| dc.subject.keywordAuthor | Intermatallics | - |
| dc.subject.keywordAuthor | Martensitic transformation | - |
| dc.subject.keywordAuthor | Rapid solidification processing | - |
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