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Increasing strength and conductivity of Cu alloy through abnormal plastic deformation of an intermetallic compoundopen access

Authors
Han, Seung ZeonLim, Sung HwanKim, SangshikLee, JehyunGoto, MasahiroKim, Hyung GiunHan, ByungchanKim, Kwang Ho
Issue Date
4-Aug-2016
Publisher
NATURE PUBLISHING GROUP
Citation
Scientific Reports, v.6
Indexed
SCI
SCIE
SCOPUS
Journal Title
Scientific Reports
Volume
6
URI
https://scholarworks.gnu.ac.kr/handle/sw.gnu/15326
DOI
10.1038/srep30907
ISSN
2045-2322
Abstract
The precipitation strengthening of Cu alloys inevitably accompanies lowering of their electric conductivity and ductility. We produced bulk Cu alloys arrayed with nanofibers of stiff intermetallic compound through a precipitation mechanism using conventional casting and heat treatment processes. We then successfully elongated these arrays of nanofibers in the bulk Cu alloys to 400% of original length without breakage at room temperature using conventional rolling process. By inducing such an one-directional array of nanofibers of intermetallic compound from the uniform distribution of fine precipitates in the bulk Cu alloys, the trade-off between strength and conductivity and between strength and ductility could be significantly reduced. We observed a simultaneous increase in electrical conductivity by 1.3 times and also tensile strength by 1.3 times in this Cu alloy bulk compared to the conventional Cu alloys.
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공학계열 > Dept.of Materials Engineering and Convergence Technology > Journal Articles

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대학원 (나노신소재융합공학과)
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