Increasing strength and conductivity of Cu alloy through abnormal plastic deformation of an intermetallic compoundopen access
- Authors
- Han, Seung Zeon; Lim, Sung Hwan; Kim, Sangshik; Lee, Jehyun; Goto, Masahiro; Kim, Hyung Giun; Han, Byungchan; Kim, Kwang Ho
- Issue Date
- 4-Aug-2016
- Publisher
- NATURE PUBLISHING GROUP
- Citation
- Scientific Reports, v.6
- Indexed
- SCI
SCIE
SCOPUS
- Journal Title
- Scientific Reports
- Volume
- 6
- URI
- https://scholarworks.gnu.ac.kr/handle/sw.gnu/15326
- DOI
- 10.1038/srep30907
- ISSN
- 2045-2322
- Abstract
- The precipitation strengthening of Cu alloys inevitably accompanies lowering of their electric conductivity and ductility. We produced bulk Cu alloys arrayed with nanofibers of stiff intermetallic compound through a precipitation mechanism using conventional casting and heat treatment processes. We then successfully elongated these arrays of nanofibers in the bulk Cu alloys to 400% of original length without breakage at room temperature using conventional rolling process. By inducing such an one-directional array of nanofibers of intermetallic compound from the uniform distribution of fine precipitates in the bulk Cu alloys, the trade-off between strength and conductivity and between strength and ductility could be significantly reduced. We observed a simultaneous increase in electrical conductivity by 1.3 times and also tensile strength by 1.3 times in this Cu alloy bulk compared to the conventional Cu alloys.
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Collections - 공학계열 > Dept.of Materials Engineering and Convergence Technology > Journal Articles
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