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Browsing by Han, Seung ZeonAuthor

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Alloy design strategies to increase strength and its trade-offs togetheropen access

Han, Seung Zeon; Choi, Eun-Ae; Lim, Sung Hwan; Kim, Sangshik; Lee, Jehyun

ArticleIssue Date2021CitationProgress in Materials Science, v.117PublisherPergamon Press Ltd.
SCIESCOPUS
Co and Ti effect on hot workability of phosphor bronzeopen access

Shin, Hyeon Seok; Han, Seung Zeon; Choi, Eun-Ae; Ahn, Jee Hyuk; Kim, Sangshik; Lee, Jehyun

ArticleIssue Date2022CitationJournal of Alloys and Compounds, v.903PublisherElsevier BV
SCIESCOPUS
Coherent interface driven super-plastic elongation of brittle intermetallic nano-fibers at room temperature

Choi, Eun-Ae; Han, Seung Zeon; Kim, Hyung Giun; Ahn, Jee Hyuk; Lim, Sung Hwan; Kim, Sangshik; Hwang, Nong-Moon; Kim, Kwangho; Lee, Jehyun

ArticleIssue Date2022CitationJournal of Materials Science & Technology, v.115, pp 97 - 102PublisherAllerton Press Inc.
SCIESCOPUSKCI
Cu-6 wt% Ni-1.4 wt% Si 합금의 압연 후 기계적 성질에 미치는 시효전 처리 영향open access

Lee, Sang Jin; Shin, Hyeon Seok; Choi, Eun-Ae; Ahn, Jee Hyuk; Choi, Yoonsuk; Kim, Sangshik; Lee, Jehyun; Han, Seung Zeon

ArticleIssue Date2020CitationKorean Journal of Metals and Materials, v.58, no.7, pp 488 - 494Publisher대한금속·재료학회
SCISCIESCOPUSKCI
Discontinuous precipitation at the deformation band in copper alloy

Han, Seung Zeon; Ahn, Jee Hyuk; You, Young Soo; Lee, Jehyun; Goto, Masahiro; Kim, Kwangho; Kim, Sangshik

ArticleIssue Date2018CitationMETALS AND MATERIALS INTERNATIONAL, v.24, no.1, pp 23 - 27PublisherKOREAN INST METALS MATERIALS
SCIESCOPUS
Effect of inclusion on strength and conductivity of Cu-Ni-Si alloys with discontinuous precipitation

Cao, Yicheng; Han, Seung Zeon; Choi, Eun-Ae; Ahn, Jee Hyuk; Mi, Xujun; Lee, Sangjin; Shin, Hyeonseok; Kim, Sangshik; Lee, Jehyun

ArticleIssue Date2020CitationJournal of Alloys and Compounds, v.843PublisherElsevier BV
SCIESCOPUS
Effect of pre-deformation before aging on discontinuous precipitation behaviour in Cu-Ni-Si alloys

Cao, Yicheng; Han, Seung Zeon; Choi, Eun-Ae; Ahn, Jee Hyuk; Mi, Xujun; Huang, Guojie; Lee, Sangjin; Shin, Hyeonseok; Kim, Sangshik; Lee, Jehyun

ArticleIssue Date2021CitationPhilosophical Magazine Letters, v.101, no.2, pp 51 - 59PublisherTaylor & Francis
SCIESCOPUS
Fatigue behavior of nano-grained copper prepared by ECAP

Han, Seung Zeon; Goto, Masahiro; Lim, Chayong; Kim, Chang Joo; Kim, Sangshik

ArticleIssue Date2007CitationJOURNAL OF ALLOYS AND COMPOUNDS, v.434, pp 304 - 306PublisherELSEVIER SCIENCE SA
SCIESCOPUS
Fatigue damage generation in ECAPed oxygen free copper

Han, Seung Zeon; Goto, Masahiro; Lim, Chayong; Kim, Su-Hyeon; Kim, Sangshik

ArticleIssue Date2009CitationJOURNAL OF ALLOYS AND COMPOUNDS, v.483, no.1-2, pp 159 - 161PublisherELSEVIER SCIENCE SA
SCIESCOPUS
Formation process of fatigue slip bands with unique configurations of ultrafine-grained high-purity Cu fabricated by severe plastic deformation

Goto, Masahiro; Yakushiji, Terutoshi; Kim, Sangshik; Yamamoto, Takaei; Han, Seung Zeon

ArticleIssue Date2022CitationJournal of Alloys and Compounds, v.899PublisherElsevier BV
SCISCIESCOPUS
Grain growth in ultrafine grain sized copper during cyclic deformation

Han, Seung Zeon; Goto, Masahiro; Ahn, Jee-Hyuk; Lim, Sung Hwan; Kim, Sangshik; Lee, Jehyun

ArticleIssue Date2014CitationJOURNAL OF ALLOYS AND COMPOUNDS, v.615, pp S587 - S589PublisherELSEVIER SCIENCE SA
SCISCIESCOPUS
Increasing strength and conductivity of Cu alloy through abnormal plastic deformation of an intermetallic compoundopen access

Han, Seung Zeon; Lim, Sung Hwan; Kim, Sangshik; Lee, Jehyun; Goto, Masahiro; Kim, Hyung Giun; Han, Byungchan; Kim, Kwang Ho

ArticleIssue Date2016CitationScientific Reports, v.6PublisherNATURE PUBLISHING GROUP
SCISCIESCOPUS
Increasing toughness by promoting discontinuous precipitation in Cu-Ni-Si alloys

Han, Seung Zeon; Lee, Jehyun; Goto, Masahiro; Lim, Sung Hwan; Ahn, Jee Hyuk; Kim, Sangshik; Kim, Kwangho

ArticleIssue Date2016CitationPHILOSOPHICAL MAGAZINE LETTERS, v.96, no.5, pp 196 - 203PublisherTAYLOR & FRANCIS LTD
SCISCIESCOPUS
Microstructural evaluation of interfacial intermetallic compounds in Cu wire bonding with Al and Au pads

Kim, Hyung Giun; Kim, Sang Min; Lee, Jae Young; Choi, Mi Ri; Choe, Si Hyun; Kim, Ki Hong; Ryu, Jae Sung; Kim, Sangshik; Han, Seung Zeon; Kim, Won Yong, et al.

ArticleIssue Date2014CitationACTA MATERIALIA, v.64, pp 356 - 366PublisherPERGAMON-ELSEVIER SCIENCE LTD
SCISCIESCOPUSKCI
Optimization of conductivity and strength in Cu-Ni-Si alloys by suppressing discontinuous precipitation

Han, Seung Zeon; Lee, Jehyun; Lim, Sung Hwan; Ahn, Jee Hyuk; Kim, Kwangho; Kim, Sangshik

ArticleIssue Date2016CitationMETALS AND MATERIALS INTERNATIONAL, v.22, no.6, pp 1049 - 1054PublisherKOREAN INST METALS MATERIALS
SCISCIESCOPUSKCI
Tensile and electrical properties of direct aged Cu-Ni-Si-x%Ti alloys

Lee, Eungyeong; Euh, Kwangjun; Han, Seung Zeon; Lim, Sunghwan; Lee, Jehyun; Kim, Sangshik

ArticleIssue Date2013CitationMETALS AND MATERIALS INTERNATIONAL, v.19, no.2, pp 183 - 188PublisherKOREAN INST METALS MATERIALS
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