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전체 가 나 다 라 마 바 사 아 자 차 카 타 파 하

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SCOPUS
Evaluation of crack growth rate and growth model of ultrafine grained copperopen access

Goto, M.; Han, S.Z.; Euh, K.; Kang, J.-H.; Kamil, K.; Kawagoishi, N.; Kim, S.S.

ArticleIssue Date2011CitationWIT Transactions on Modelling and Simulation, v.51, pp 327 - 338
SCISCIESCOPUS
Fatigue-induced grain coarsening and crack growth behavior in ultrafine-grained copper under different loading histories

Goto, M.; Kamil, K.; Han, S. Z.; Euh, K.; Kim, S. S.; Lee, J.

ArticleIssue Date2013CitationINTERNATIONAL JOURNAL OF FATIGUE, v.51, pp 57 - 67PublisherELSEVIER SCI LTD
SCISCIESCOPUS
Formation behavior of different topographies of crack growth path under high and low cyclic stresses in ultrafine-grained copper

Goto, M.; Kamil, K.; Han, S. Z.; Euh, K.; Yokoho, Y.; Kim, S. S.

ArticleIssue Date2012CitationSCRIPTA MATERIALIA, v.66, no.6, pp 355 - 358PublisherPERGAMON-ELSEVIER SCIENCE LTD
SCISCIESCOPUS
Formation of a high-cycle fatigue fracture surface and a crack growth mechanism of ultrafine-grained copper with different stages of microstructural evolution

Goto, M.; Han, S. Z.; Euh, K.; Kang, J-H; Kim, S. S.; Kawagoishi, N.

ArticleIssue Date2010CitationACTA MATERIALIA, v.58, no.19, pp 6294 - 6305PublisherPERGAMON-ELSEVIER SCIENCE LTD
SCISCIESCOPUS
High-cycle fatigue strength and small-crack growth behavior of ultrafine-grained copper with post-ECAP annealing

Goto, M.; Teshima, N.; Han, S. Z.; Euh, K.; Yakushiji, T.; Kim, S. S.; Lee, J.

ArticleIssue Date2013CitationENGINEERING FRACTURE MECHANICS, v.110, pp 218 - 232PublisherPERGAMON-ELSEVIER SCIENCE LTD
SCISCIESCOPUS
The effect of microstructural inhomogeneity on the growth paths of surface-cracks in copper processed by equal channel angular pressing

Goto, M.; Ando, Y.; Han, S. Z.; Kim, S. S.; Kawagoishi, N.; Euh, K.

ArticleIssue Date2010CitationENGINEERING FRACTURE MECHANICS, v.77, no.11, pp 1914 - 1925PublisherPERGAMON-ELSEVIER SCIENCE LTD
SCISCIESCOPUS
The role of mixed-mode deformation at the crack tip on shear banding and crack propagation of ultrafine-grained copper

Goto, M.; Han, S. Z.; Ahn, J. H.; Yakushiji, T.; Euh, K.; Kim, S. S.; Lee, J.

ArticleIssue Date2014CitationINTERNATIONAL JOURNAL OF FATIGUE, v.66, pp 220 - 228PublisherELSEVIER SCI LTD
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