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Microstructural evaluation and failure analysis of Ag wire bonded to Al pads

Choi, Mi-Ri; Kim, Hyung-Giun; Lee, Taeg-Woo; Jeon, Young-Jun; Ahn, Yong-Keun; Koo, Kyo-Wang; Jang, You-Cheol; Park, So-Yeon; Yee, Jae-Hak; Cho, Nam-Kwon, et al.

ArticleIssue Date2015CitationMICROELECTRONICS RELIABILITY, v.55, no.11, pp 2306 - 2315PublisherPERGAMON-ELSEVIER SCIENCE LTD
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