상세 보기
Growth behavior of small surface cracks in coarse and ultrafine grained copper
- Goto, M.;
- Han, S. Z.;
- Ando, Y.;
- Kawagoishi, N.;
- Teshima, N.;
- ... Kim, S. S.
WEB OF SCIENCE
0SCOPUS
1초록
Since fatigue life of a plain specimen of ductile metals is controlled mainly by the propagation life of a small surface crack, to clarify the growth behavior of a small crack is crucial to the safe design of smooth members. However, little has been reported on the growth behavior of small surface cracks in ultrafine grained (UFG) metals. In the present study, stress-controlled fatigue tests for coarse grained (CG) and UFG copper were conducted. The surface damage evolution during cyclic stressing was observed by optical microscopy, and the growth behavior of a small surface crack was monitored by a plastic replication technique. The physical background of fatigue damage for CG and UFG copper was discussed from the viewpoints of the initiation and growth behavior of small surface cracks.
키워드
- 제목
- Growth behavior of small surface cracks in coarse and ultrafine grained copper
- 저자
- Goto, M.; Han, S. Z.; Ando, Y.; Kawagoishi, N.; Teshima, N.; Kim, S. S.
- 발행일
- 2009
- 유형
- Proceedings Paper
- 저널명
- COMPUTATIONAL METHODS AND EXPERIMENTAL MEASUREMENTS XIV
- 권
- 48
- 페이지
- 497 ~ +
- 언어
- ENG
- 출판사
- WIT PRESS
- 발행국가
- 영국
- ISSN
- P 1746-4064