상세 보기
- Yun, Sang-Du;
- Kim, Yeonwon;
- Lee, Jun-Seok;
- Noh, Jung-Pil;
- Kim, Beom Soo;
- ... Kwon, Jae-Sung;
- ... Choi, Sung-Woong;
- ... Yang, Jeong-Hyeon
WEB OF SCIENCE
1SCOPUS
1초록
To investigate the improvements in the resistance of Cu-Ni alloys to surface pitting corrosion, Cu-Ni thin films containing Al were fabricated via DC magnetron sputtering. The morphologies of the fabricated samples were obtained using a scanning electron microscopy, which yielded information on the crystal size and sample surface before and after corrosion tests. X-ray diffraction was employed for the structural characterization of the as-deposited films, and vibrational spectroscopy was used to verify the corrosion products. The corrosion behaviors of the Cu-Ni and Cu-Ni-Al samples were examined using electrochemical polarization and cyclic corrosion tests. The Al co-deposited samples showed a refined crystal size as compared to the Cu-Ni sample, suggesting that they are more susceptible to the formation of a passivation film. The corrosion current density of the Cu-Ni-Al was reduced, and the corrosion potential was lower than that without Al content. The negative shift in the corrosion potential of the Al-containing samples indicates that the Al2O3 film suppressed the cathodic reaction, resulting in a decrease in the corrosion rate. These results are consistent with the cyclic corrosion test results, in which no pitting corrosion is observed in the Cu-Ni-Al sample.
키워드
- 제목
- Aluminum Co-Deposition via DC Magnetron Sputtering for Enhanced Pitting Resistance of Copper-Nickel Alloys
- 저자
- Yun, Sang-Du; Kim, Yeonwon; Lee, Jun-Seok; Noh, Jung-Pil; Kim, Beom Soo; Kwon, Jae-Sung; Choi, Sung-Woong; Yang, Jeong-Hyeon
- 발행일
- 2024-01
- 유형
- Article
- 저널명
- Coatings
- 권
- 14
- 호
- 1