전기수력학 인쇄 기술을 활용한 마이크로 패턴의 은전극이 임베디드 된 고 전도성 유연 전극 기판 개발

High-Conductivity Flexible Electrode Substrates with Embedded Ag Micropatterns via Electrohydrodynamic Jet Printing

초록

Under the increasing interest in wearable devices and healthcare monitoring systems, there has been active research into soft electronic devices composed of mechanically flexible and stretchable materials, as well as cost-effective printed electronics technologies. Electrohydrodynamic jet (EHD) printing has emerged as a next-generation printed electronics technology, theoretically enabling high-resolution printing while simplifying the patterning process. In this study, we systematically investigated the effect of main process and post-process variables in EHD printing on the resolution and physical properties of printed devices. Consequently, we successfully fabricated electrode patterns with a linewidth of 25 μm and a thickness of 82 nm, exhibiting an electrical conductivity of 2.84×105 S⋅cm-1, comparable to that of pure silver metal. Moreover, by introducing a transfer process onto flexible substrates, we developed flexible films with embedded electrode patterns on the surface of polymer substrates, while maintaining the electrical conductivity of the electrodes. These findings provide valuable insights for the development of high-performance, flexible electronic devices using EHD printing technology.

키워드

Electrohydrodynamic jet printingMicro patterningEmbedded electrode
제목
전기수력학 인쇄 기술을 활용한 마이크로 패턴의 은전극이 임베디드 된 고 전도성 유연 전극 기판 개발
제목 (타언어)
High-Conductivity Flexible Electrode Substrates with Embedded Ag Micropatterns via Electrohydrodynamic Jet Printing
저자
정유정김영진최현호
DOI
10.17702/jai.2025.26.2.64
발행일
2025-06
저널명
접착 및 계면
26
2
페이지
64 ~ 71