Texture and microstructure in Ni-W alloy tape manufactured by the powder metallurgy process

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초록

Ni-3at.%W alloy tapes for YBCO coated conductor were fabricated by powder metallurgy process including powder compaction, cold isostatic pressing(CIP), cold rolling and annealing for recrystallization. The Ni-3at.%W tapes annealed in an atmosphere of 96%Ar and 4%H-2 mixing gas were characterized by X-ray pole figures, orientation distribution function(ODF) and optical microscopy(OM). The Ni-W alloy tapes were heat-treated at 700 similar to 1000 degrees C for the development of cube texture {001}< 100 >. The texture analysis indicated that as fabricated tapes have a sharp cube texture after annealing at 900 and 1000 degrees C. Also, thoroughly recrystallization takes place for the annealed tapes at the both temperatures and the average grain size of the two tapes is about the same, which is about 35 mu m.

키워드

Ni tapecube texturepowder metallurgyCRITICAL-CURRENT DENSITYSUPERCONDUCTING TAPESDEPOSITIONFILMS
제목
Texture and microstructure in Ni-W alloy tape manufactured by the powder metallurgy process
저자
Kim, Sang SukBae, Sung YealAhn, In SupKim, Cheol JinKim, Ki WonCho, Kwon Koo
DOI
10.4028/www.scientific.net/SSP.124-126.1493
발행일
2007-06
유형
Proceedings Paper
저널명
Solid State Phenomena
124-126
PART 2
페이지
1493 ~ +