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Utilization of Wood by-product and Development of Horticultural Growing Media
- Jung, Ji Young;
- Lim, Ki-Byung;
- Kim, Ji Su;
- Park, Han Min;
- Yang, Jae-Kyung
WEB OF SCIENCE
3SCOPUS
7초록
The main objective of this work was to identify and evaluate possible substrate alternatives or amendments to peat moss. This study involves the physical and chemical characterization and growth test of wood sawdust and wood fiber in order to evaluate their use as components of horticultural media. The carbohydrate content, C/N ratio, pH, phenolic compound, total porosity and water holding capacity were 58.9%, 425.1, 4.8, 181.8 (mg.g(-1)), 82.5% and 47.1% in wood sawdust and 41.1%, 240.8, 5.9, 29.8 (mg.g(-1)), 90.6% and 56.2% in wood fiber, respectively. Wood sawdust (K, 998.0 mg.100g(-1); Ca, 1196.0 mg.100g(-1); Mg, 105.6 mg.100g(-1)) and wood fiber (K, 1250.1 mg.100g(-1); Ca, 1982.6 mg.100g(-1); Mg, 173.1 mg.100g(-1)) showed adequate mineral elements properties compared to peat moss (K, 0.02 mg.100g(-1); Ca, 0.57 mg.100g(-1); Mg, 0.13 mg.100g(-1)) for their use as growing media. The mixtures of the horticultural media were prepared using different substrate as wood sawdust and wood fiber to grow Chinese cabbage (Brassica campestris L.) in a greenhouse. The seed germination, leaf area and stem height were 75%, 0.50 cm(2) and 2.8 cm in PS substrate (containing 30% peat moss, 10% perlite and 60% wood sawdust) and 95%, 0.65 cm(2) and 3.3 cm in PF substrate (containing 30% peat moss, 10% perlite and 60% wood fiber), respectively. The seed germination and stem height of the PF substrate (containing 30% peat moss, 10% perlite and 60% wood fiber) was higher than those in peat moss (control). Utilization of wood by-product can be considered as an alternative media component to substitute the widely using expensive peat moss.
키워드
- 제목
- Utilization of Wood by-product and Development of Horticultural Growing Media
- 저자
- Jung, Ji Young; Lim, Ki-Byung; Kim, Ji Su; Park, Han Min; Yang, Jae-Kyung
- 발행일
- 2015-06
- 유형
- Article
- 저널명
- 원예과학기술지
- 권
- 33
- 호
- 3
- 페이지
- 435 ~ 442