Growth mechanism of a small surface crack of ultrafine-grained copper in a high-cycle fatigue regime

Goto, M.; Han, S. Z.; Kim, S. S.; Ando, Y.; Kawagoishi, N.

doi:10.1016/j.scriptamat.2009.01.003

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Growth mechanism of a small surface crack of ultrafine-grained copper in a high-cycle fatigue regime

Goto, M.;
Han, S. Z.;
Kim, S. S.;
Ando, Y.;
Kawagoishi, N.

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WEB OF SCIENCE

8

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SCOPUS

11

초록

High-cycle fatigue tests were carried out on specimens of ultrafine-grained copper produced by equal channel angular pressing. The growth behavior of a small surface crack was monitored. A major crack, which led to the final fracture of the specimen, initiated from shear bands. After initiation, the crack grew linearly in the shear direction of the final pressing. A decrease in growth rate with a change in growth path morphology occurred when the crack length reached l similar to 0.1 mm. This decrease occurred because of a change in the crack growth mechanism and is explained by considering the interrelation between grain size and the reversible plastic zone size at the crack tip. (C) 2009 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

키워드

Fatigue test; Equal channel angular pressing; Copper; Reversible plastic zone; Small crack; SEVERE PLASTIC-DEFORMATION; AL-MG ALLOY; CARBON-STEELS; BEHAVIOR; PROPAGATION; DAMAGE; METALS; SHEAR; LIFE; LAW

제목: Growth mechanism of a small surface crack of ultrafine-grained copper in a high-cycle fatigue regime

저자: Goto, M.; Han, S. Z.; Kim, S. S.; Ando, Y.; Kawagoishi, N.

DOI: 10.1016/j.scriptamat.2009.01.003

발행일: 2009-04

유형: Article

저널명: Scripta Materialia

권: 60

호: 8

페이지: 729 ~ 732

언어: ENG

출판사: PERGAMON-ELSEVIER SCIENCE LTD

발행국가: 영국

분량: 4 페이지

ISSN: P 1359-6462