ScholarWorks@경상국립대학교

초록

The need for large-area cross-sectional analysis with nanometer precision is rapidly growing in various advanced manufacturing sectors. Traditional focused ion beam (FIB) techniques are too slow for milling millimeter-scale volumes. They often introduce ion implantation, redeposition, and curtaining effect, which ultimately prevent effective large-area processing and analysis. To overcome these limitations, we developed a hybrid machining process integrating femtosecond laser micromachining for rapid roughing with FIB milling for precision finishing. Angle of incidence (AOI) control during laser machining was employed to minimize the taper angle of laser-ablated sidewalls, thereby significantly reducing subsequent FIB milling volume. Using a 1030 nm, 350 fs laser, we achieved nearly vertical sidewalls (taper angle: ~2.5° vs. ~28°without AOI control) in silicon. Raman spectroscopy revealed a laser-affected zone extending about 2 μm perpendicular to the sidewall, indicating the need for further FIB milling besides laser-tapered regions to remove laser-induced damage. On multilayer ceramic capacitors and micropillar fabrication, the hybrid laser-FIB method achieved efficient large-area cross sections with preserved microscale details. We present the development of an integrated triple-beam system combining laser, plasma FIB, and SEM, capable of fast volume removal and nanoscale imaging in one equipment. This approach can markedly improve throughput for large-area cross-sectional analysis.

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