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Ultra-low temperature co-fired CaV2O6-glass composite ceramic substrate for microelectronics

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dc.contributor.authorSasidharanpillai, Arun-
dc.contributor.authorThomas, Sebastian Mailadil-
dc.contributor.authorLee, Younki-
dc.contributor.authorKim, Hyo Tae-
dc.date.accessioned2022-12-26T15:02:56Z-
dc.date.available2022-12-26T15:02:56Z-
dc.date.issued2019-04-
dc.identifier.issn0957-4522-
dc.identifier.issn1573-482X-
dc.identifier.urihttps://scholarworks.gnu.ac.kr/handle/sw.gnu/9270-
dc.description.abstractBivalent calcium metavanadate (CaV2O6) ceramic-glass composite substrates were fabricated using non-aqueous environmental friendly tape casting formulation. 3wt% of commercial glass was added to the calcined powder of CaV2O6 to achieve a sintering temperature of 650 degrees C which enables ultra-low temperature co-firing with aluminum electrode. An environmentally benign binder/solvent (Polypropylene carbonate/dimethyl carbonate) system was adopted to prepare the well dispersed slurry for tape casting. The crystal structure and co-fireability of the sintered substrate with Al was verified by X-ray diffraction technique. Thermal, dielectric and morphological analysis of the multilayer were analyzed. The room temperature thermal conductivity of CaV2O6-glass composite sintered at 650 degrees C is about 2.8W/mK. Sintered ceramics shows a relatively high linear coefficient of thermal expansion (CTE) of 11.46ppm/degrees C, which is favorable for co-firing with high CTE metallic materials. Microwave dielectric properties of CaV2O6-glass composite multilayer fired at 650 degrees C are epsilon(r)=10.6 and tan=3.19x10(-4)at 15GHz.-
dc.format.extent8-
dc.language영어-
dc.language.isoENG-
dc.publisherKluwer Academic Publishers-
dc.titleUltra-low temperature co-fired CaV2O6-glass composite ceramic substrate for microelectronics-
dc.typeArticle-
dc.publisher.location네델란드-
dc.identifier.doi10.1007/s10854-019-01079-5-
dc.identifier.scopusid2-s2.0-85062996980-
dc.identifier.wosid000467637200046-
dc.identifier.bibliographicCitationJournal of Materials Science: Materials in Electronics, v.30, no.8, pp 7637 - 7644-
dc.citation.titleJournal of Materials Science: Materials in Electronics-
dc.citation.volume30-
dc.citation.number8-
dc.citation.startPage7637-
dc.citation.endPage7644-
dc.type.docTypeArticle-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClasssci-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaPhysics-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.relation.journalWebOfScienceCategoryPhysics, Condensed Matter-
dc.subject.keywordPlusMICROWAVE DIELECTRIC-PROPERTIES-
dc.subject.keywordPlusFLUID-FLOW MODEL-
dc.subject.keywordPlusTHERMAL-CONDUCTIVITY-
dc.subject.keywordPlusCRYSTAL-STRUCTURE-
dc.subject.keywordPlusGLASS COMPOSITE-
dc.subject.keywordPlusTAPE-
dc.subject.keywordPlusLTCC-
dc.subject.keywordPlusPERFORMANCE-
dc.subject.keywordPlusROUGHNESS-
dc.subject.keywordPlusBURNOUT-
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