Cited 8 time in
Ultra-low temperature co-fired CaV2O6-glass composite ceramic substrate for microelectronics
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Sasidharanpillai, Arun | - |
| dc.contributor.author | Thomas, Sebastian Mailadil | - |
| dc.contributor.author | Lee, Younki | - |
| dc.contributor.author | Kim, Hyo Tae | - |
| dc.date.accessioned | 2022-12-26T15:02:56Z | - |
| dc.date.available | 2022-12-26T15:02:56Z | - |
| dc.date.issued | 2019-04 | - |
| dc.identifier.issn | 0957-4522 | - |
| dc.identifier.issn | 1573-482X | - |
| dc.identifier.uri | https://scholarworks.gnu.ac.kr/handle/sw.gnu/9270 | - |
| dc.description.abstract | Bivalent calcium metavanadate (CaV2O6) ceramic-glass composite substrates were fabricated using non-aqueous environmental friendly tape casting formulation. 3wt% of commercial glass was added to the calcined powder of CaV2O6 to achieve a sintering temperature of 650 degrees C which enables ultra-low temperature co-firing with aluminum electrode. An environmentally benign binder/solvent (Polypropylene carbonate/dimethyl carbonate) system was adopted to prepare the well dispersed slurry for tape casting. The crystal structure and co-fireability of the sintered substrate with Al was verified by X-ray diffraction technique. Thermal, dielectric and morphological analysis of the multilayer were analyzed. The room temperature thermal conductivity of CaV2O6-glass composite sintered at 650 degrees C is about 2.8W/mK. Sintered ceramics shows a relatively high linear coefficient of thermal expansion (CTE) of 11.46ppm/degrees C, which is favorable for co-firing with high CTE metallic materials. Microwave dielectric properties of CaV2O6-glass composite multilayer fired at 650 degrees C are epsilon(r)=10.6 and tan=3.19x10(-4)at 15GHz. | - |
| dc.format.extent | 8 | - |
| dc.language | 영어 | - |
| dc.language.iso | ENG | - |
| dc.publisher | Kluwer Academic Publishers | - |
| dc.title | Ultra-low temperature co-fired CaV2O6-glass composite ceramic substrate for microelectronics | - |
| dc.type | Article | - |
| dc.publisher.location | 네델란드 | - |
| dc.identifier.doi | 10.1007/s10854-019-01079-5 | - |
| dc.identifier.scopusid | 2-s2.0-85062996980 | - |
| dc.identifier.wosid | 000467637200046 | - |
| dc.identifier.bibliographicCitation | Journal of Materials Science: Materials in Electronics, v.30, no.8, pp 7637 - 7644 | - |
| dc.citation.title | Journal of Materials Science: Materials in Electronics | - |
| dc.citation.volume | 30 | - |
| dc.citation.number | 8 | - |
| dc.citation.startPage | 7637 | - |
| dc.citation.endPage | 7644 | - |
| dc.type.docType | Article | - |
| dc.description.isOpenAccess | N | - |
| dc.description.journalRegisteredClass | sci | - |
| dc.description.journalRegisteredClass | scie | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.relation.journalResearchArea | Engineering | - |
| dc.relation.journalResearchArea | Materials Science | - |
| dc.relation.journalResearchArea | Physics | - |
| dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
| dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
| dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
| dc.relation.journalWebOfScienceCategory | Physics, Condensed Matter | - |
| dc.subject.keywordPlus | MICROWAVE DIELECTRIC-PROPERTIES | - |
| dc.subject.keywordPlus | FLUID-FLOW MODEL | - |
| dc.subject.keywordPlus | THERMAL-CONDUCTIVITY | - |
| dc.subject.keywordPlus | CRYSTAL-STRUCTURE | - |
| dc.subject.keywordPlus | GLASS COMPOSITE | - |
| dc.subject.keywordPlus | TAPE | - |
| dc.subject.keywordPlus | LTCC | - |
| dc.subject.keywordPlus | PERFORMANCE | - |
| dc.subject.keywordPlus | ROUGHNESS | - |
| dc.subject.keywordPlus | BURNOUT | - |
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