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Stress Deformation of a Gear Module a Taping Device Drive

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dc.contributor.author김남열-
dc.contributor.author류성기-
dc.contributor.author박용우-
dc.date.accessioned2025-06-12T06:01:55Z-
dc.date.available2025-06-12T06:01:55Z-
dc.date.issued2025-05-
dc.identifier.issn1598-6721-
dc.identifier.issn2288-0771-
dc.identifier.urihttps://scholarworks.gnu.ac.kr/handle/sw.gnu/78690-
dc.description.abstractWiring harnesses used for information transmission and signal control in rotary-wing aircraft play critical roles in the aerospace and automotive industries as well as require precision and reliability. To insulate the wire bundle of each element of the wire harness, a portion of the wire bundle was peeled off locally, the core wires were connected, and this portion was insulated using insulating tape. Even when multiple wire bundles were connected, the wires were wrapped with tape to form a wiring harness. Currently, manually taping a wire bundle takes a substantial amount time, and the quality of the taping is not constant, depending on the skill level of the operator. Taping devices that utilize rotational forces have been employed to overcome these problems. In this study, we designed a part that transmits power through a gear module made of metal inside a taping device.-
dc.format.extent12-
dc.language영어-
dc.language.isoENG-
dc.publisher한국기계가공학회-
dc.titleStress Deformation of a Gear Module a Taping Device Drive-
dc.typeArticle-
dc.publisher.location대한민국-
dc.identifier.doi10.14775/ksmpe.2025.24.5.062-
dc.identifier.bibliographicCitation한국기계가공학회지, v.24, no.5, pp 62 - 73-
dc.citation.title한국기계가공학회지-
dc.citation.volume24-
dc.citation.number5-
dc.citation.startPage62-
dc.citation.endPage73-
dc.identifier.kciidART003203903-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClasskci-
dc.subject.keywordAuthorGear(기어)-
dc.subject.keywordAuthorModule(모듈)-
dc.subject.keywordAuthorStress Analysis(응력해석)-
dc.subject.keywordAuthorTaping Device(테이핑 장치)-
dc.subject.keywordAuthorHarness(하네스)-
dc.subject.keywordAuthorStress Deformation(응력변형)-
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공학계열 > 기계항공우주공학부 > Journal Articles

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대학원 (기계항공우주공학부)
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