전자제품 Cu 방열 모듈 배관 접합을 위한 멀티 코어 레이저 용접 공정 연구

Abstract

As electronic components demand higher performance and greater density, the need for enhanced heat dissipation characteristics has increased. Currently, heat dissipation modules rely on soldered copper piping; however, the use of filler materials reduces both thermal efficiency and mechanical properties. This study investigates the process conditions for multi-core laser welding, aiming to reduce production costs and process times while maintaining energy efficiency. Through experimental analysis, the applicability of the process was evaluated by comparing the microstructure and mechanical properties of soldered joint pipes with those of laser-welded joint pipes used in actual electronic products. The heat dissipation pipes joined by laser welding exhibited approximately three times greater mechanical strength than their soldered counterparts, and it is anticipated that the shortened process will further reduce both costs and production time.