열전모듈 시스템 냉각장치 유로내 엠보싱이 열전달 특성에 미치는 영향

Abstract

The generation of thermoelectric power relies on the Seebeck effect, which creates an electromotive force as a result of a temperature differential between p-type and n-type semiconductors. The use of soil-based thermoelectric materials confers several advantages, including compactness, lightweight design, and vibration-free operation. The objective of this study is to devise a cooling system that can be affixed to the low-temperature section of the thermoelectric module, utilising skutterudite thermoelectric material that is effective in the medium-to-high temperature range. In the previous study, four types were identified. The simplest flow path and lowest pressure drop between the inlet and outlet were observed in one of these, and embossing was added. The average temperature and temperature uniformity between the thermoelectric module and the cooling device, as well as the pressure drop between the inlet and outlet, were selected as the performance indicators of the cooling system. This study will examine the impact of changes in mass flow rate, embossing diameter, and the presence or absence of embossing on the heat transfer characteristics of a cooling system attached to the low-temperature part of a thermoelectric module. It is known that an increased coolant flow rate and an appropriate embossing diameter will have a positive impact on the performance of a thermoelectric generator.