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전처리 조건에 따른 TMP용 칩의 고효율 연화처리에 대한 연구
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김철환 | - |
| dc.date.accessioned | 2023-08-04T14:44:55Z | - |
| dc.date.available | 2023-08-04T14:44:55Z | - |
| dc.date.issued | 2014-10-24 | - |
| dc.identifier.uri | https://scholarworks.gnu.ac.kr/handle/sw.gnu/62388 | - |
| dc.title | 전처리 조건에 따른 TMP용 칩의 고효율 연화처리에 대한 연구 | - |
| dc.title.alternative | Studies on softening treatment efficiency of wood chip for TMP by pre-treatment conditions | - |
| dc.type | Conference | - |
| dc.citation.title | 한국펄프종이공학회 추계학술논문 발표집 | - |
| dc.citation.startPage | 121 | - |
| dc.citation.conferenceName | 한국펄프종이공학회 추계학술대회 | - |
| dc.citation.conferencePlace | 대한민국 | - |
| dc.citation.conferencePlace | 전주페이퍼 | - |
| dc.citation.conferenceDate | 2014-10-23 ~ 2014-10-24 | - |
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