Fatigue behavior of nano-grained copper prepared by ECAP
- Authors
- Han, Seung Zeon; Goto, Masahiro; Lim, Chayong; Kim, Chang Joo; Kim, Sangshik
- Issue Date
- 31-May-2007
- Publisher
- ELSEVIER SCIENCE SA
- Keywords
- nano-grain; copper; ECAP; fatigue; fatigue damage
- Citation
- JOURNAL OF ALLOYS AND COMPOUNDS, v.434, pp 304 - 306
- Pages
- 3
- Indexed
- SCIE
SCOPUS
- Journal Title
- JOURNAL OF ALLOYS AND COMPOUNDS
- Volume
- 434
- Start Page
- 304
- End Page
- 306
- URI
- https://scholarworks.gnu.ac.kr/handle/sw.gnu/28374
- DOI
- 10.1016/j.jallcom.2006.08.179
- ISSN
- 0925-8388
1873-4669
- Abstract
- In order to study the fatigue behavior of ultra-fine grained copper, rotating bending fatigue test has been carried out. After 4 passes of ECAP (equal channel angular pressing) with Bc route, grains with about 300nm diameter were formed. Specimens were fatigued at three constant stress amplitudes; sigma a = 240, 120 and 80 MPa. Significant differences in morphological feature in fatigued surfaces between high and low cyclic deformation amplitudes were observed. To clarify the formation process of surface damage, morphological changes in surface damage caused by cyclic stresses were monitored successively by optical microscope and SEM. (C) 2006 Elsevier B.V. All rights reserved.
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Collections - 공학계열 > Dept.of Materials Engineering and Convergence Technology > Journal Articles

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