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Influences of fabrication processes on electrochemical properties of Si thin film electrodes for Li ion microbatteries
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Cho, Gyu-bong | - |
| dc.contributor.author | Lee, Bong-ki | - |
| dc.contributor.author | Sin, Won-chul | - |
| dc.contributor.author | Cho, Kwon-koo | - |
| dc.contributor.author | Kim, Ki-won | - |
| dc.contributor.author | Ahn, Hyo-jun | - |
| dc.date.accessioned | 2022-12-27T06:17:33Z | - |
| dc.date.available | 2022-12-27T06:17:33Z | - |
| dc.date.issued | 2008-01-31 | - |
| dc.identifier.issn | 0925-8388 | - |
| dc.identifier.issn | 1873-4669 | - |
| dc.identifier.uri | https://scholarworks.gnu.ac.kr/handle/sw.gnu/27523 | - |
| dc.description.abstract | Influences of fabrication processes on electrochemical properties of Si thin film electrodes were investigated by utilizing a Ni buffer layer and annealing the fabricated films. Electrochemical properties of four Si film electrodes (Si/Cu, annealed Si/Cu, Si/Ni/Cu and annealed Si/Ni/Cu) fabricated with different processes were evaluated. Si electrode films fabricated on Cu substrate and Ni film were amorphous and their structures are still maintained after annealing. Fine Ni clusters with a trigonal shape were observed in the Ni/Cu film and coalesced after annealing. The highest capacity efficiency can be obtained from the Li/Si cell with the annealed Si/Ni/Cu film. The insertion of the Ni film as a buffer film and the post-annealing enhanced adhesion between Si film and Cu substrate. (c) 2007 Elsevier B.V. All rights reserved. | - |
| dc.format.extent | 5 | - |
| dc.language | 영어 | - |
| dc.language.iso | ENG | - |
| dc.publisher | ELSEVIER SCIENCE SA | - |
| dc.title | Influences of fabrication processes on electrochemical properties of Si thin film electrodes for Li ion microbatteries | - |
| dc.type | Article | - |
| dc.publisher.location | 스위스 | - |
| dc.identifier.doi | 10.1016/j.jallcom.2006.02.099 | - |
| dc.identifier.scopusid | 2-s2.0-36448985718 | - |
| dc.identifier.wosid | 000252737500071 | - |
| dc.identifier.bibliographicCitation | JOURNAL OF ALLOYS AND COMPOUNDS, v.449, no.1-2, pp 308 - 312 | - |
| dc.citation.title | JOURNAL OF ALLOYS AND COMPOUNDS | - |
| dc.citation.volume | 449 | - |
| dc.citation.number | 1-2 | - |
| dc.citation.startPage | 308 | - |
| dc.citation.endPage | 312 | - |
| dc.type.docType | Article; Proceedings Paper | - |
| dc.description.isOpenAccess | N | - |
| dc.description.journalRegisteredClass | scie | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.relation.journalResearchArea | Chemistry | - |
| dc.relation.journalResearchArea | Materials Science | - |
| dc.relation.journalResearchArea | Metallurgy & Metallurgical Engineering | - |
| dc.relation.journalWebOfScienceCategory | Chemistry, Physical | - |
| dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
| dc.relation.journalWebOfScienceCategory | Metallurgy & Metallurgical Engineering | - |
| dc.subject.keywordPlus | LITHIUM | - |
| dc.subject.keywordPlus | ANODE | - |
| dc.subject.keywordAuthor | microbattery | - |
| dc.subject.keywordAuthor | Si electrode | - |
| dc.subject.keywordAuthor | Ni buffer film | - |
| dc.subject.keywordAuthor | annealing | - |
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