Detailed Information

Cited 24 time in webofscience Cited 25 time in scopus
Metadata Downloads

Tensile Behavior of commercially pure copper sheet fabricated by 2- and 3-layered accumulative roll bonding (ARB) process

Full metadata record
DC Field Value Language
dc.contributor.authorJang, Younghwan-
dc.contributor.authorKim, Sangshik-
dc.contributor.authorHan, Seungzeon-
dc.contributor.authorLim, Chayong-
dc.contributor.authorGoto, Masahiro-
dc.date.accessioned2022-12-27T06:10:47Z-
dc.date.available2022-12-27T06:10:47Z-
dc.date.issued2008-04-
dc.identifier.issn1598-9623-
dc.identifier.issn2005-4149-
dc.identifier.urihttps://scholarworks.gnu.ac.kr/handle/sw.gnu/27448-
dc.description.abstractThe tensile properties of two- and three-layered accumulative roll-bonding (ARB) processed copper sheets containing deoxidized low-phosphorous copper (DLP) and PMC90 are investigated with varying numbers of ARB process cycles. The tensile strength of the DLP is determined by the applied equivalent strain, showing that the tensile strength values for both 2-L and 3-L ARBed DLP specimens follow a single trend line. Unlike the DLP, the 3-L ARBed PMC90 follows a trend line that is completely different compared to that of its 2-L counterpart above an equivalent strain value of 7.6, suggesting that the amount of applied equivalent strain alone does not control the tensile strength of PMC90. The mechanism determining the tensile behavior of 2-L and 3-L ARB processed commercially pure copper sheets is discussed.-
dc.format.extent5-
dc.language영어-
dc.language.isoENG-
dc.publisherKOREAN INST METALS MATERIALS-
dc.titleTensile Behavior of commercially pure copper sheet fabricated by 2- and 3-layered accumulative roll bonding (ARB) process-
dc.typeArticle-
dc.publisher.location대한민국-
dc.identifier.doi10.3365/met.mat.2008.04.171-
dc.identifier.scopusid2-s2.0-43149112325-
dc.identifier.wosid000255485200007-
dc.identifier.bibliographicCitationMETALS AND MATERIALS INTERNATIONAL, v.14, no.2, pp 171 - 175-
dc.citation.titleMETALS AND MATERIALS INTERNATIONAL-
dc.citation.volume14-
dc.citation.number2-
dc.citation.startPage171-
dc.citation.endPage175-
dc.type.docTypeArticle-
dc.identifier.kciidART001239648-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.description.journalRegisteredClasskci-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaMetallurgy & Metallurgical Engineering-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryMetallurgy & Metallurgical Engineering-
dc.subject.keywordPlusOXYGEN-FREE COPPER-
dc.subject.keywordPlusDEFORMATION-
dc.subject.keywordPlusALUMINUM-
dc.subject.keywordAuthoraccumulative roll bonding-
dc.subject.keywordAuthortensile behavior-
dc.subject.keywordAuthorpure copper-
Files in This Item
There are no files associated with this item.
Appears in
Collections
공학계열 > Dept.of Materials Engineering and Convergence Technology > Journal Articles

qrcode

Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.

Related Researcher

Researcher Kim, Sang Shik photo

Kim, Sang Shik
대학원 (나노신소재융합공학과)
Read more

Altmetrics

Total Views & Downloads

BROWSE