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The effect of microstructural inhomogeneity on the growth paths of surface-cracks in copper processed by equal channel angular pressing
- Authors
- Goto, M.; Ando, Y.; Han, S. Z.; Kim, S. S.; Kawagoishi, N.; Euh, K.
- Issue Date
- Jul-2010
- Publisher
- PERGAMON-ELSEVIER SCIENCE LTD
- Keywords
- Fatigue; Ultrafine grain; Copper; Crack propagation; Fracture surface
- Citation
- ENGINEERING FRACTURE MECHANICS, v.77, no.11, pp 1914 - 1925
- Pages
- 12
- Indexed
- SCI
SCIE
SCOPUS
- Journal Title
- ENGINEERING FRACTURE MECHANICS
- Volume
- 77
- Number
- 11
- Start Page
- 1914
- End Page
- 1925
- ISSN
- 0013-7944
1873-7315
- Abstract
- The growth behavior of cracks is monitored on specimens of ultrafine grained copper produced by equal channel angular pressing. Temporary retardation of crack growth under low stress amplitudes occurs when the crack length reaches about 0.1 mm, but there is no similar retardation at high stress amplitudes. Dependent on stress amplitude, different crack growth path morphologies develop. Analysis of the fracture surfaces is conducted by scanning electron microscopy, showing planer, granular and striated surfaces. The physical background of growth path and fracture surface formation is discussed by considering crack growth mechanism and microstructural inhomogeneity. (c) 2010 Elsevier Ltd. All rights reserved.
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