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Cited 7 time in webofscience Cited 6 time in scopus
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Shape memory effect-induced crack closure in Si thin film deposited on a Ti-50.3Ni (at%) alloy substrate

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dc.contributor.authorCho, Gyu-bong-
dc.contributor.authorKim, Bo-min-
dc.contributor.authorChoi, Hee-jin-
dc.contributor.authorNoh, Jung-pil-
dc.contributor.authorChoi, Si-young-
dc.contributor.authorAhn, Hyo-jun-
dc.contributor.authorMiyazaki, Shuichi-
dc.contributor.authorNam, Tae-hyun-
dc.date.accessioned2022-12-27T04:06:02Z-
dc.date.available2022-12-27T04:06:02Z-
dc.date.issued2010-09-24-
dc.identifier.issn0925-8388-
dc.identifier.issn1873-4669-
dc.identifier.urihttps://scholarworks.gnu.ac.kr/handle/sw.gnu/24944-
dc.description.abstractCracks developed by tensile loading in the Si thin film deposited on the Ti-50.3Ni (at%) substrate were closed by the shape memory effect of the substrate. The interfacial layer formed after annealing at 873 K between the Si thin film and the substrate was essential for the shape memory effect-induced crack closure. Cracks which formed during lithiation in the Si thin film annealed at 873 K after deposition were closed by delithiation followed by heating up to 373 K. (C) 2010 Elsevier B.V. All rights reserved.-
dc.language영어-
dc.language.isoENG-
dc.publisherELSEVIER SCIENCE SA-
dc.titleShape memory effect-induced crack closure in Si thin film deposited on a Ti-50.3Ni (at%) alloy substrate-
dc.typeArticle-
dc.publisher.location스위스-
dc.identifier.doi10.1016/j.jallcom.2010.07.136-
dc.identifier.scopusid2-s2.0-77956616232-
dc.identifier.wosid000283005300003-
dc.identifier.bibliographicCitationJOURNAL OF ALLOYS AND COMPOUNDS, v.507, no.1, pp L8 - L12-
dc.citation.titleJOURNAL OF ALLOYS AND COMPOUNDS-
dc.citation.volume507-
dc.citation.number1-
dc.citation.startPageL8-
dc.citation.endPageL12-
dc.type.docTypeArticle-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClasssci-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaChemistry-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaMetallurgy & Metallurgical Engineering-
dc.relation.journalWebOfScienceCategoryChemistry, Physical-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryMetallurgy & Metallurgical Engineering-
dc.subject.keywordPlusLI-ION BATTERIES-
dc.subject.keywordPlusNI-
dc.subject.keywordPlusSILICON-
dc.subject.keywordPlusANODE-
dc.subject.keywordPlusSYSTEM-
dc.subject.keywordPlusELECTRODE-
dc.subject.keywordPlusBEHAVIOR-
dc.subject.keywordAuthorShape memory alloys (SMA)-
dc.subject.keywordAuthorSputtering-
dc.subject.keywordAuthorScanning electron microscopy (SEM)-
dc.subject.keywordAuthorInterface structure-
dc.subject.keywordAuthorCrack closure-
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