Cited 1 time in
Evaluation of crack growth rate and growth model of ultrafine grained copper
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Goto, M. | - |
| dc.contributor.author | Han, S.Z. | - |
| dc.contributor.author | Euh, K. | - |
| dc.contributor.author | Kang, J.-H. | - |
| dc.contributor.author | Kamil, K. | - |
| dc.contributor.author | Kawagoishi, N. | - |
| dc.contributor.author | Kim, S.S. | - |
| dc.date.accessioned | 2022-12-27T03:53:44Z | - |
| dc.date.available | 2022-12-27T03:53:44Z | - |
| dc.date.issued | 2011 | - |
| dc.identifier.issn | 1743-355X | - |
| dc.identifier.uri | https://scholarworks.gnu.ac.kr/handle/sw.gnu/24760 | - |
| dc.description.abstract | High-cycle fatigue tests were carried out on smooth specimens of ultrafine grained (UFG) copper produced by equal channel angular pressing for 12 passes. The growth behavior of a small surface-crack was monitored. A major crack, which led to the final fracture of the specimen, initiated from shear bands (SBs) at an early stage of stressing. Different tendencies of growth behavior occurred depending on the ranges of crack length. To understand the changes in growth rate and fracture surface morphologies, a quantitative model describing a crack growth mechanism were developed considering the reversible plastic zone size at a crack tip. In addition, the crack growth rate of UFG copper was evaluated by applying the small-crack growth raw. ? 2011 WIT Press. | - |
| dc.format.extent | 12 | - |
| dc.language | 영어 | - |
| dc.language.iso | ENG | - |
| dc.title | Evaluation of crack growth rate and growth model of ultrafine grained copper | - |
| dc.type | Article | - |
| dc.identifier.doi | 10.2495/CMEM110291 | - |
| dc.identifier.scopusid | 2-s2.0-84875838112 | - |
| dc.identifier.bibliographicCitation | WIT Transactions on Modelling and Simulation, v.51, pp 327 - 338 | - |
| dc.citation.title | WIT Transactions on Modelling and Simulation | - |
| dc.citation.volume | 51 | - |
| dc.citation.startPage | 327 | - |
| dc.citation.endPage | 338 | - |
| dc.type.docType | Conference Paper | - |
| dc.description.isOpenAccess | Y | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.subject.keywordAuthor | Copper | - |
| dc.subject.keywordAuthor | Crack propagation | - |
| dc.subject.keywordAuthor | Fatigue | - |
| dc.subject.keywordAuthor | Fine grains | - |
| dc.subject.keywordAuthor | Surface damage | - |
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
Gyeongsang National University Central Library, 501, Jinju-daero, Jinju-si, Gyeongsangnam-do, 52828, Republic of Korea+82-55-772-0532
COPYRIGHT 2022 GYEONGSANG NATIONAL UNIVERSITY LIBRARY. ALL RIGHTS RESERVED.
Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.
