Detailed Information

Cited 0 time in webofscience Cited 1 time in scopus
Metadata Downloads

Evaluation of crack growth rate and growth model of ultrafine grained copper

Full metadata record
DC Field Value Language
dc.contributor.authorGoto, M.-
dc.contributor.authorHan, S.Z.-
dc.contributor.authorEuh, K.-
dc.contributor.authorKang, J.-H.-
dc.contributor.authorKamil, K.-
dc.contributor.authorKawagoishi, N.-
dc.contributor.authorKim, S.S.-
dc.date.accessioned2022-12-27T03:53:44Z-
dc.date.available2022-12-27T03:53:44Z-
dc.date.issued2011-
dc.identifier.issn1743-355X-
dc.identifier.urihttps://scholarworks.gnu.ac.kr/handle/sw.gnu/24760-
dc.description.abstractHigh-cycle fatigue tests were carried out on smooth specimens of ultrafine grained (UFG) copper produced by equal channel angular pressing for 12 passes. The growth behavior of a small surface-crack was monitored. A major crack, which led to the final fracture of the specimen, initiated from shear bands (SBs) at an early stage of stressing. Different tendencies of growth behavior occurred depending on the ranges of crack length. To understand the changes in growth rate and fracture surface morphologies, a quantitative model describing a crack growth mechanism were developed considering the reversible plastic zone size at a crack tip. In addition, the crack growth rate of UFG copper was evaluated by applying the small-crack growth raw. ? 2011 WIT Press.-
dc.format.extent12-
dc.language영어-
dc.language.isoENG-
dc.titleEvaluation of crack growth rate and growth model of ultrafine grained copper-
dc.typeArticle-
dc.identifier.doi10.2495/CMEM110291-
dc.identifier.scopusid2-s2.0-84875838112-
dc.identifier.bibliographicCitationWIT Transactions on Modelling and Simulation, v.51, pp 327 - 338-
dc.citation.titleWIT Transactions on Modelling and Simulation-
dc.citation.volume51-
dc.citation.startPage327-
dc.citation.endPage338-
dc.type.docTypeConference Paper-
dc.description.isOpenAccessY-
dc.description.journalRegisteredClassscopus-
dc.subject.keywordAuthorCopper-
dc.subject.keywordAuthorCrack propagation-
dc.subject.keywordAuthorFatigue-
dc.subject.keywordAuthorFine grains-
dc.subject.keywordAuthorSurface damage-
Files in This Item
There are no files associated with this item.
Appears in
Collections
공학계열 > Dept.of Materials Engineering and Convergence Technology > Journal Articles

qrcode

Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.

Related Researcher

Researcher Kim, Sang Shik photo

Kim, Sang Shik
대학원 (나노신소재융합공학과)
Read more

Altmetrics

Total Views & Downloads

BROWSE