Analysis of magnetic field distribution in a cylindrical-type magnetron sputtering system

Abstract

The magnetic field distribution in magnetron sputtering processes has been verified to influence the collision of positive ions on the target, as well as the efficiency of the deposition onto the substrate. However, locally concentrated collision due to the distribution has also been known to lead to nonuniform erosion on the target, which deteriorates the efficiency of sputtering. In this study, a cylindrical magnetron sputtering system with a rotary-type target is proposed to improve the expected lifetime of the target by reducing the local erosion of target in the magnetron sputtering process. For the sputtering system, the magnetic field distribution over the target was analyzed with finite element method. Based on the analysis, the effect of the configuration of permanent magnets on the magnetic field distribution was investigated. The result of the analysis could be used to predict the region where concentration of positive ions occurs and thus to estimate the pattern of how the erosion on the target surface would occur for the proposed system. The results also reveal that the magnetic field distribution related to the erosion pattern could be controlled with the configuration of the permanent magnets.