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A Study on Cure Monitoring of Fast Cure Resin RTM Process Using Dielectrometry

Authors
Park, Seul-KiKim, Cheol-HwanChoi, Jin-Ho
Issue Date
Jun-2017
Publisher
KOREAN SOC COMPOSITE MATERIALS
Keywords
Dielectrometry; Dissipation factor; Filter; Resin
Citation
COMPOSITES RESEARCH, v.30, no.3, pp 202 - 208
Pages
7
Indexed
ESCI
KCI
Journal Title
COMPOSITES RESEARCH
Volume
30
Number
3
Start Page
202
End Page
208
URI
https://scholarworks.gnu.ac.kr/handle/sw.gnu/13713
DOI
10.7234/composres.2017.30.3.202
ISSN
2288-2103
2288-2111
Abstract
Resin transfer molding (RTM) is a mass production process that allows the fabrication of composites ranging in size from small to large. Recently, fast curing resins with a curing time of less than about 10 minutes have been used in the automotive and aerospace industries. The viscosity of resin is bound up with the degree of cure, and it can be changed rapidly in the fast-cure resin system during the mold filling process. Therefore, it is advantageous to experimentally measure and evaluate the degree of cure because it requires much effort to predict the flow characteristics and cure of the fast curing resin. DMA and dielectric technique are the typical methods to measure the degree of cure of composite materials. In this paper, the resin flow and degree of cure were measured through the multi- channel dielectric system. A total of 8 channels of dielectric sensors were used and resin flow and degree of cure were measured and compared with each other under various pressure conditions.
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Choi, Jin Ho
대학원 (기계항공우주공학부)
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